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ON FDG8850NZ
Mosfet Array 30V 750mA 300mW Surface Mount SC-88 (SC-70-6)
Marcas: ON Semiconductor, LLC
Parte do fabricante #: FDG8850NZ
Ficha de dados: FDG8850NZ Datasheet (PDF)
Pacote/Caso: SC-70-6
Tipo de Produto: Transistores
Status RoHS:
Condição de estoque: 3148 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaFDG8850NZ Descrição geral
This dual N-Channel logic level enhancement mode field effect transistors are produced using a proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. This device has been designed especially for low voltage applications as a replacement for bipolar digital transistors and small signal MOSFETs. Since bias resistors are not required, this dual digital FET can replace several different digital transistors, with different bias resistor values.
Características
- Max rDS(on) = 0.4Ω at VGS = 4.5V, ID = 0.75A
- Max rDS(on) = 0.5Ω at VGS = 2.7V, ID = 0.67A
- Very low level gate drive requirements allowing operationin 3V circuits(VGS(th) <1.5V)
- Very small package outline SC70-6
- RoHS Compliant
Aplicativo
- This product is general usage and suitable for many different applications.
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Source Content uid | FDG8850NZ | Pbfree Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
| Package Description | ROHS COMPLIANT, SC-70, 6 PIN | Manufacturer Package Code | 419AD |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| Factory Lead Time | 73 Weeks | Samacsys Manufacturer | onsemi |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | DS Breakdown Voltage-Min | 30 V |
| Drain Current-Max (ID) | 0.75 A | Drain-source On Resistance-Max | 0.4 Ω |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | Feedback Cap-Max (Crss) | 25 pF |
| JESD-30 Code | R-PDSO-G6 | JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 | Number of Elements | 2 |
| Number of Terminals | 6 | Operating Mode | ENHANCEMENT MODE |
| Operating Temperature-Max | 150 °C | Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 | Polarity/Channel Type | N-CHANNEL |
| Power Dissipation-Max (Abs) | 0.36 W | Qualification Status | Not Qualified |
| Surface Mount | YES | Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | Transistor Application | SWITCHING |
| Transistor Element Material | SILICON | feature-category | Power MOSFET |
| feature-material | feature-process-technology | DMOS | |
| feature-configuration | Dual | feature-channel-mode | Enhancement |
| feature-channel-type | N | feature-number-of-elements-per-chip | 2 |
| feature-maximum-drain-source-voltage-v | 30 | feature-maximum-gate-source-voltage-v | ±12 |
| feature-maximum-gate-threshold-voltage-v | feature-maximum-continuous-drain-current-a | 0.75 | |
| feature-maximum-drain-source-resistance-mohm | [email protected] | feature-typical-gate-charge-vgs-nc | [email protected] |
| feature-typical-gate-charge-10v-nc | feature-typical-input-capacitance-vds-pf | 90@10V | |
| feature-typical-output-capacitance-pf | feature-maximum-power-dissipation-mw | 360 | |
| feature-packaging | Tape and Reel | feature-rad-hard | |
| feature-pin-count | 6 | feature-supplier-package | SC-70 |
| feature-standard-package-name1 | SOT | feature-cecc-qualified | No |
| feature-esd-protection | feature-military | No | |
| feature-aec-qualified | No | feature-aec-qualified-number | |
| feature-auto-motive | No | feature-p-pap | No |
| feature-eccn-code | EAR99 | feature-svhc | No |
| feature-svhc-exceeds-threshold | No |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
 |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
 |
PayPal | cobrar taxa de serviço de 4,0%. |
 |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
 |
Western Union | charge US.00 banking fee. |
 |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The FDG8850NZ chip is a semiconductive component used in electronic devices. It is designed to perform specific functions within a circuit, providing functionality and control. This chip offers advanced features and capabilities, making it suitable for various applications such as telecommunications, consumer electronics, and automotive systems. Its compact size and efficiency make it a popular choice among manufacturers for integrating into their products.
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Pinout
The FDG8850NZ is a dual P-channel PowerTrench MOSFET with a pin count of 6 (SOT-923 package). It is typically used for power management applications in mobile devices. -
Manufacturer
FDG8850NZ is a model number of a refrigerator manufactured by Samsung, a South Korean multinational conglomerate company. Samsung is primarily known for its consumer electronics products, including appliances, smartphones, and televisions. It is one of the largest and most well-known electronics manufacturers globally, with a diverse range of products and services. -
Application Field
The FDG8850NZ is a hybrid integrated circuit (IC) designed for use in digital audio applications. Its application areas include audio amplification, audio processing, and audio streaming devices. It can be used in various consumer electronics products such as smartphones, tablets, smart speakers, and portable audio players. -
Package
The FDG8850NZ chip is available in a small surface-mount package type called SOT-223. It is in a single form and has a compact size of approximately 6.70mm x 6.70mm.
Ficha de dados PDF
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A quantidade mínima de pedido começa em 1 unidade.
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365 dias de garantia de qualidade para todos os produtos
Our company has been using Ovaga's electronic components for years and we've never had any issues. 5 stars for reliability!