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Xilinx XC7S100-2FGGA676I
The XC7S100-2FGGA676I is a high-performance FPGA from the Spartan-7 series with 676-pin Fine-Pitch Ball Grid Array package
Marcas: Xilinx
Parte do fabricante #: XC7S100-2FGGA676I
Ficha de dados: XC7S100-2FGGA676I Datasheet (PDF)
Pacote/Caso: FBGA-676
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 3776 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaXC7S100-2FGGA676I Descrição geral
The XC7S100-2FGGA676I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-7 family of FPGAs and features a total of 101,440 logic cells, 6,800 slices, and 17,200 flip-flops. The device operates on a 1.8V nominal supply voltage and has I/O standards compatible with LVCMOS, LVTTL, PCI, HSTL, LVDS, and SSTL.The XC7S100-2FGGA676I comes in a 676-pin Fine Pitch Ball Grid Array (FGGA) package with a body size of 27 x 27 mm and a ball pitch of 1 mm. This package is designed for easy integration onto circuit boards and provides high signal integrity. The FPGA also features 44 configurable I/O banks that can be programmed to support a wide range of applications.In terms of performance, the XC7S100-2FGGA676I offers a maximum operating frequency of 450 MHz and a 1024-bit block RAM with a total capacity of 8,192 Kbits. It also includes built-in clock management resources such as Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs) to facilitate clock distribution and synchronization within the device.
Características
- 7 Series FPGA, 101440 Logic Cells
- 69760 LUTs, 139520 Flip-flops
- 3476 Kbits of Block RAM
- 480 DSP Slices
- 1225 GMACs of processing power
- 12.5 Gbps transceivers
- 676-pin Fine-pitch Ball Grid Array (FGGA) package
Aplicativo
- Wireless communication systems
- Video processing and encoding applications
- High-speed networking equipment
- Industrial automation and control systems
- Medical imaging devices
- Defense and aerospace systems
- Automotive electronics
- High-performance computing applications
- Embedded systems
- Signal processing applications
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC7S100 | Number of Logic Elements | 102400 LE |
| Adaptive Logic Modules - ALMs | 16000 ALM | Embedded Memory | 4.22 Mbit |
| Number of I/Os | 400 I/O | Supply Voltage - Min | 950 mV |
| Supply Voltage - Max | 1.05 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-676 | Brand | Xilinx |
| Distributed RAM | 1100 kbit | Embedded Block RAM - EBR | 4320 kbit |
| Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 8000 LAB |
| Operating Supply Voltage | 1 V | Product Type | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
| Tradename | Spartan |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
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Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
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Part points
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XC7S100-2FGGA676I is a programmable logic chip manufactured by Xilinx. It belongs to the Spartan-7 family and comes in a 676-pin Fine-Pitch Ball Grid Array (FGGA) package. The chip offers 101,440 logic cells, 600Kbits of distributed RAM, and 240 DSP slices. It supports various interfaces like PCIe, Ethernet, USB, and more, making it suitable for a wide range of applications requiring flexible and high-performance digital logic capabilities.
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Equivalent
Some equivalent products of the XC7S100-2FGGA676I chip are the XC7S100-1FGGA676I, XC7S100-2FGGA676, and XC7S100-1FGGA676. -
Features
The features of XC7S100-2FGGA676I include a Spartan-7 FPGA with 101,440 logic cells, 144 I/O pins, and a fabric clock speed up to 650 MHz. It has 6.4 Gbps transceivers, 4,096 LUTRAM blocks, and 2,048 distributed RAM blocks. It supports various I/O standards, offers abundant routing resources, and includes on-chip voltage regulators for power supply flexibility. -
Pinout
The XC7S100-2FGGA676I is an FPGA from the Xilinx Spartan-7 series. It has a pin count of 676 and is packaged in an FGGA676I. The pin count refers to the number of external connections available on the device, while the function of the FPGA is to provide programmable logic and processing capabilities for various applications. -
Manufacturer
The manufacturer of the XC7S100-2FGGA676I is Xilinx Inc. Xilinx is a leading American semiconductor company specializing in the development of programmable logic devices and related software tools. They are known for creating field-programmable gate arrays (FPGAs) and systems on chips (SoCs) used in various industries such as telecommunications, automotive, aerospace, and consumer electronics. -
Application Field
The XC7S100-2FGGA676I is a field programmable gate array (FPGA) that can be used in a wide range of applications, including telecommunications, data processing, high-performance computing, industrial automation, and automotive electronics. -
Package
The XC7S100-2FGGA676I chip is offered in the FGGA676 package type.
Ficha de dados PDF
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