Xilinx XC6SLX150-3FGG676C

Part points

• The XC6SLX150-3FGG676C chip is a field-programmable gate array (FPGA) designed by Xilinx. It has a Spartan-6 LX family architecture and offers 147,443 logic cells, 6,720 kilobits of RAM, and 684 input/output pins. It operates at a maximum frequency of 550 MHz and supports a wide range of applications including digital signal processing, telecommunications, video processing, and more.

• Equivalent

  The XC6SLX150-3FGG676C chip is part of the Spartan-6 family from Xilinx. Equivalent products include other members of the Spartan-6 series like XC6SLX100, XC6SLX150T, and XC6SLX150-2FGG676C.

• Features

  The XC6SLX150-3FGG676C is a Xilinx Spartan-6 FPGA with 147,443 logic cells, 6,460 Kbits of block RAM, 380 DSP slices, and a maximum of 572 user I/O pins. It operates at a maximum frequency of 450 MHz, has 3.3V I/O voltage, and comes in a 676-pin FG676 package. It is equipped with advanced features such as embedded memory and DSP resources for efficient and high-performance design implementations.

• Pinout

  The XC6SLX150-3FGG676C has a pin count of 676. It is a field-programmable gate array (FPGA) from the Spartan-6 family manufactured by Xilinx. Xilinx FPGAs can be reconfigured to fit a variety of applications, allowing for flexible circuit design and customization.

• Manufacturer

  The manufacturer of the XC6SLX150-3FGG676C is Xilinx Inc., which is a technology company specializing in designing and developing programmable logic devices and related software tools. Xilinx is widely recognized as one of the leading manufacturers of field-programmable gate arrays (FPGAs) and programmable logic ICs.

• Application Field

  The XC6SLX150-3FGG676C is a Field-Programmable Gate Array (FPGA) that is suitable for a variety of applications. It can be used in networking, telecommunications, aerospace, defense, automotive, and industrial sectors. It offers high-performance processing capabilities, superior power efficiency, and flexible design options, making it ideal for complex digital systems.

• Package

  The XC6SLX150-3FGG676C chip comes in a FG676 package type, and its form factor is a BGA (Ball Grid Array) package. The size of the chip is 27 mm x 27 mm.