Xilinx XC2V500-4FG456C

Part points

• The XC2V500-4FG456C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It offers 500,000 system gates and 12,288 CLBs, making it suitable for various applications. The chip operates at a temperature range of -40°C to +85°C and supports various input/output standards. Its high-performance architecture, large capacity, and flexibility in design make it a popular choice for electronic systems.

• Equivalent

  The equivalent products of the XC2V500-4FG456C chip are Xilinx XC2S500-5FG456C, XC2S200-5FG256C, XC2V8000-4FF1517C, and XC2S150-5FG256C.

• Features

  XC2V500-4FG456C is a field-programmable gate array (FPGA) with 500,000 system gates. It supports a maximum of 4,608 logic elements, 112 Kbits of total block RAM, and 128 user I/O pins. It operates at a maximum frequency of 400 MHz and uses a 1.5V core voltage.

• Pinout

  The XC2V500-4FG456C is an FPGA (Field Programmable Gate Array) device. It has 456 pins and belongs to the Spartan-II family of FPGAs from Xilinx. The specific functions of each pin vary, but they generally serve to provide inputs and outputs for the programmable logic blocks and other peripherals within the FPGA.

• Manufacturer

  XC2V500-4FG456C is manufactured by Xilinx, Inc. It is an American technology company specializing in the development, manufacturing, and sale of programmable logic devices like Field-Programmable Gate Arrays (FPGAs) and associated software tools. Xilinx products find applications in various industries, including automotive, aerospace, telecommunications, and consumer electronics.

• Application Field

  The XC2V500-4FG456C is a field-programmable gate array (FPGA) that can be used in a wide range of applications, including telecommunications, aerospace, automotive, and consumer electronics. It provides a flexible platform for implementing digital logic circuits and can be reprogrammed to suit different requirements, making it suitable for various application areas.

• Package

  The XC2V500-4FG456C chip comes in a Ball Grid Array (BGA) package type. Its form is in a rectangular shape. The size of the chip is 456 balls or pins.