Xilinx XC7K70T-1FBG676C

Part points

• XC7K70T-1FBG676C is a programmable integrated circuit, specifically a field-programmable gate array (FPGA). It belongs to the Xilinx Kintex-7 family. This chip offers a high level of logic capacity, I/O capabilities, and performance for various applications such as high-speed data processing, communication systems, and digital signal processing. With its 1FBG676C package, it provides a high pin count and ease of integration into FPGA-based designs.

• Equivalent

  XC7K70T-1FBG676C is an FPGA chip from Xilinx. Equivalent products from the same series include XC7K70T-1FBG484C, XC7K70T-2FBG484C, and XC7K70T-3FBG676C. These are different variants of the same chip with varying specifications, such as number of logic cells and I/O pins, but they belong to the same Xilinx Kintex-7 family.

• Features

  The XC7K70T-1FBG676C is an integrated circuit from the Xilinx Kintex-7 FPGA family. It has a package type of FBG676 and contains 70,160 logic cells, 2,160 Kbits of block RAM, and 208 DSP slices. The device operates at a speed grade of -1 and has 676 pins.

• Pinout

  The XC7K70T-1FBG676C is a field-programmable gate array (FPGA) from the Xilinx Kintex-7 series. It has a pin count of 676 and is in a Fine Ball Grid Array (FBGA) package. The specific functions of the pins on this device can be obtained from the device datasheet for detailed information.

• Manufacturer

  The manufacturer of the XC7K70T-1FBG676C is Xilinx. Xilinx is a technology company specializing in the design and manufacture of semiconductor devices, particularly programmable logic devices (PLD) and field-programmable gate arrays (FPGA). They provide advanced solutions for a wide range of industries including aerospace, automotive, telecommunications, and more.

• Application Field

  The XC7K70T-1FBG676C is a field-programmable gate array (FPGA) designed for high-performance applications such as communications, aerospace, and defense. It can be used in various areas including signal processing, image and video processing, networking, and data storage, due to its versatile and powerful capabilities.

• Package

  The XC7K70T-1FBG676C chip has a package type of FBG676, which stands for Fine-pitch Ball Grid Array with 676 balls. The form of the chip is known as 1 and its size is K70T.