Xilinx XC7K325T-1FBG676C

Part points

• The XC7K325T-1FBG676C chip is a member of Xilinx's 7 series FPGAs. It offers a high level of processing power and programmability. With its 325,000 logic cells, this chip is suitable for a wide range of applications including aerospace, defense, and telecommunications. The FBG676C package features 676 pins making it compatible with various PCB layouts. Overall, this chip provides a versatile and efficient solution for complex digital system designs.

• Equivalent

  Some equivalent products of the XC7K325T-1FBG676C chip include the XC7K325T-1FFG676I, XC7K325T-1FFG676C, and XC7K325T-1FFG676E chips.

• Features

  The XC7K325T-1FBG676C is a field-programmable gate array (FPGA) with a capacity of 325,000 logic cells and 1,800 DSP slices. It operates at a maximum speed of 1.066 GHz, has 2400Kb of block RAM, and supports various I/O standards. This particular model is housed in a FBG676 package.

• Pinout

  The XC7K325T-1FBG676C is a Field Programmable Gate Array (FPGA) with 676 Ball Grid Array (BGA) packaging. It has a pin count of 676. The function of the device is to provide programmable logic and I/O capabilities for implementation of digital circuits in various applications.

• Manufacturer

  Xilinx is the manufacturer of the XC7K325T-1FBG676C. It is a technology company specializing in field-programmable gate arrays (FPGA) and programmable logic devices.

• Application Field

  The XC7K325T-1FBG676C is a field-programmable gate array (FPGA) that can be used in various applications such as telecommunications, aerospace and defense, automotive, industrial control, and scientific research. It provides high-performance processing capabilities and programmable logic, making it suitable for complex and demanding tasks in these fields.

• Package

  The XC7K325T-1FBG676C chip has a Ball Grid Array (BGA) package type, a 676-pin grid array form, and a size of 27 mm x 27 mm.