Xilinx XC3S1500-5FG676C

Part points

• The XC3S1500-5FG676C is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Spartan-3 family and has 1,536 slices, which are the primary building blocks of the chip. The chip operates at a maximum speed of 500 MHz and comes in a 676-ball grid array package. It offers programmable logic functionality and is commonly used in various electronic and communication applications.

• Equivalent

  Some equivalent products of the XC3S1500-5FG676C chip are the XC3S1500-5FG900C and XC3S1200E-4FG320C.

• Features

  The XC3S1500-5FG676C is an FPGA (Field-Programmable Gate Array) with 1,536 logic cells, 36,864 flip-flops, and a maximum clock frequency of 625MHz. It has 68 I/O pins and supports various I/O standards. Additionally, it offers advanced configuration modes, JTAG programming, and multiple power management options.

• Pinout

  The XC3S1500-5FG676C is an FPGA (Field Programmable Gate Array) with a pin count of 676. It is designed to implement digital circuits and is capable of performing various functions based on user-defined programming.

• Manufacturer

  The manufacturer of the XC3S1500-5FG676C is Xilinx. Xilinx is a semiconductor company that specializes in programmable logic devices and related software tools. They are known for their field-programmable gate arrays (FPGAs) and are a leading provider of these products to various industries worldwide.

• Application Field

  The XC3S1500-5FG676C is a field-programmable gate array (FPGA) that can be used in various applications, including telecommunications, automotive, industrial automation, defense, and consumer electronics. It is capable of implementing complex digital systems, providing high-performance and versatility for various industries and applications.

• Package

  The XC3S1500-5FG676C chip is a Field-Programmable Gate Array (FPGA) available in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with a size of 27x27 mm.