K4B2G1646F-BYK0

Part points

• The K4B2G1646F-BYK0 chip is a high-performance 2Gb DDR3 SDRAM chip designed for use in various electronic devices, including computers and mobile devices. It features fast data transfer speeds, low power consumption, and reliable performance.

• Equivalent

  Some alternative products to the K4B2G1646F-BYK0 chip include: K4B2G1646G-BYK0, K4B2G1646F-BYJ0, K4B2G1646Q-BYK0, and K4B2G1646H-BYK0. These chips have similar specifications and performance capabilities, making them suitable replacements for the K4B2G1646F-BYK0 in various applications.

• Features

  - DDR4 SDRAM with 4Gb density - Speed of up to 2400Mbps - Low operating voltage of 1.2V - 78-ball FBGA package - Internal banks for concurrent operation - On-die termination for better signal integrity - RoHS compliant

• Pinout

  The K4B2G1646F-BYK0 is a DDR3 SDRAM with a 96-ball FBGA package. It has a 13x9 ball array with a pitch of 0.8mm and a ball size of 0.6mm. The functions of the pins include power supply, address/command inputs, data inputs/outputs, clocks, and a reset pin.

• Manufacturer

  The manufacturer of the K4B2G1646F-BYK0 is Samsung Electronics. Samsung Electronics is a South Korean multinational corporation that specializes in the manufacture of electronics such as smartphones, televisions, and memory components. The company is one of the largest manufacturers of memory chips in the world.

• Application Field

  The K4B2G1646F-BYK0 is commonly used in various electronic devices such as smartphones, tablets, digital cameras, and other portable electronic devices. It is also used in networking equipment, servers, and automotive systems to provide high-speed and reliable memory storage capabilities for efficient performance.