Infineon BSM150GB60DLC

Part points

• The BSM150GB60DLC is a power module chip designed for high power applications, such as motor drives and inverters. It offers a high power density and excellent thermal performance, making it ideal for use in a variety of industrial applications. The chip features low switching losses and high efficiency, contributing to improved performance and energy savings.

• Equivalent

  The equivalent products of BSM150GB60DLC chip are Infineon FF150R12KT4, Infineon FF150R12KT3, and Toshiba MG150Q2YS51. These chips are also IGBT modules with similar specifications and characteristics, making them suitable alternatives for various applications.

• Features

  1. 150A/600V IGBT module 2. Soft switching TRENCHSTOP™ IGBT4 3. Freewheeling diode with fast recovery 4. NTC temperature sensor 5. High short-circuit rating 6. Low inductive construction 7. Modules can be paralleled for higher current capabilities

• Pinout

  BSM150GB60DLC is a dual IGBT module with a pin count of 8 pins. It is designed for use in power electronics applications and features high power efficiency and reliability. Each IGBT module functions as a half-bridge configuration, offering high power output capability.

• Manufacturer

  BSM150GB60DLC is manufactured by Infineon Technologies, a German semiconductor manufacturing company. Infineon Technologies specializes in offering semiconductor and system solutions for automotive, industrial, and consumer electronics, as well as chip card and security products. Their products cater to various industries, including automotive, industrial, and power applications.

• Application Field

  BSM150GB60DLC is commonly used in various applications such as motor control, renewable energy systems, and power supplies. It is also used in industrial automation, electric vehicles, and traction applications due to its high efficiency, reliability, and performance capabilities.

• Package

  The BSM150GB60DLC chip is a IGBT module with a dual half bridge configuration. It is in the 62mm x 32mm form factor and has a package size of 7.6mm x 3mm. This module is designed for high power applications with a current rating of 150A and voltage rating of 600V.