Xilinx XCV50-6BG256C
Versatile integrated circuit for signal processing
Marcas: Xilinx
Parte do fabricante #: XCV50-6BG256C
Ficha de dados: XCV50-6BG256C Datasheet (PDF)
Pacote/Caso: BGA-256
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2859 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaXCV50-6BG256C Descrição geral
The XCV50-6BG256C is a member of Xilinx's Virtex-II Pro family of FPGAs (Field-Programmable Gate Arrays). It features a 50,000 gate equivalent logic capacity and 6 ns propagation delay. The device comes in a 256-pin Ball Grid Array (BGA) package.This FPGA offers a variety of features and capabilities, including embedded PowerPC processors, advanced DSP functionalities, and support for various high-speed connectivity standards. It also includes integrated block RAM and configurable I/O capabilities.The XCV50-6BG256C is optimized for high-performance applications that require complex programmable logic and embedded processing capabilities. It is suitable for a wide range of applications, including networking, telecommunications, industrial control systems, and audio/video processing.With its advanced architecture and capabilities, the XCV50-6BG256C offers designers flexibility and scalability to meet the demands of their specific application requirements. It provides a balance of performance, power efficiency, and integration, making it a versatile choice for a variety of embedded system designs
Características
- Programmable logic IC
- 256-ball BGA package
- 50,000 system gates
- 6ns tpd
- 100 user I/Os
- 1.8V to 5.5V supply voltage
- 5V tolerant I/Os
Aplicativo
- Embedded systems
- Automotive electronics
- Industrial control systems
- Electronic instrumentations
- Communication systems
- Power management systems
- Medical electronics
- Aerospace technology
- Consumer electronics
- Networking and data storage systems
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Category | FPGA - Field Programmable Gate Array | Series | XCV50 |
Number of Logic Elements | 1728 LE | Adaptive Logic Modules - ALMs | 768 ALM |
Embedded Memory | 32 kbit | Number of I/Os | 180 I/O |
Supply Voltage - Min | 2.5 V | Supply Voltage - Max | 2.5 V |
Minimum Operating Temperature | 0 C | Maximum Operating Temperature | + 85 C |
Mounting Style | SMD/SMT | Package / Case | BGA-256 |
Brand | Xilinx | Embedded Block RAM - EBR | 32768 bit |
Maximum Operating Frequency | 200 MHz | Number of Gates | 57906 |
Number of Logic Array Blocks - LABs | 384 LAB | Operating Supply Voltage | 2.5 V |
Product Type | FPGA - Field Programmable Gate Array | Subcategory | Programmable Logic ICs |
Tradename | Virtex |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XCV50-6BG256C chip is a field-programmable gate array (FPGA) by Xilinx. It offers 50,000 logic cells and can be used for various applications requiring high-performance processing. With a 6-speed grade, it provides enhanced performance and flexibility. The chip is housed in a 256-ball grid array (BGA) package, making it suitable for compact designs and low-power applications.
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Equivalent
There are no direct equivalent products to the XCV50-6BG256C chip. However, you may look for similar devices like XCV50, Virtex-I E FPGAs, or other members of the Xilinx Virtex-I E FPGA family that offer similar features and capabilities. -
Features
The XCV50-6BG256C is a field-programmable gate array (FPGA) with 50,000 logic cells, a 1360 MHz maximum operating frequency, 256 I/O pins, 18-bit input/output width, and 6,000 CLBs (Configurable Logic Blocks). It offers high-performance and flexible programmability for various applications in industries like telecommunications, automotive, and aerospace. -
Pinout
The XCV50-6BG256C has 256 pins. It is an FPGA (Field-Programmable Gate Array) with 50,000 logic cells and a speed grade of -6. It has various functions, including digital signal processing, high-speed communication interfaces, and general-purpose logic applications. -
Manufacturer
The manufacturer of the XCV50-6BG256C is Xilinx Inc. Xilinx Inc. is a semiconductor company that specializes in the development and production of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs). They provide programmable platforms and solutions that enable a wide range of applications, such as data centers, embedded systems, and aerospace/defense projects. -
Application Field
The XCV50-6BG256C FPGA is commonly used in various application areas including telecommunications, industrial automation, automotive, aerospace, and defense sectors. It is specifically designed for high-performance applications that require programmable logic flexibility and advanced processing capabilities. -
Package
The XCV50-6BG256C chip package type is BGA (Ball Grid Array), form factor is 256-BGA (17x17), and the size is 256-ball with a pitch of 1 mm.
Ficha de dados PDF
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