Xilinx XCV100E-6BGG352C

Part points

• The XCV100E-6BGG352C chip is an advanced programmable logic device manufactured by Xilinx. It provides high-performance and efficient solutions for various applications, such as telecommunications, automotive, and industrial sectors. With its unique architecture and rich features, the chip allows for complex system integration and customization, making it an ideal choice for designers looking for flexible and reliable programmable logic solutions.

• Features

  The XCV100E-6BGG352C is a Field Programmable Gate Array (FPGA) device. It has 100,352 logic cells, 151,712 flip-flops, and a maximum of 5,520 slices. It has 128 input/output (I/O) pins and operates at a maximum frequency of 200 MHz. It also includes other features like memory blocks, Digital Clock Managers (DCMs), and dedicated multipliers.

• Pinout

  The XCV100E-6BGG352C is an FPGA (Field-Programmable Gate Array) with a pin count of 352. It consists of multiple input/output pins (I/O), power supply pins, and configuration pins. The specific functions of each pin can be found in the device's datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XCV100E-6BGG352C is Xilinx Inc. Xilinx is an American technology company that specializes in the design and production of programmable logic devices, software, and development tools for the semiconductor industry.

• Application Field

  The XCV100E-6BGG352C is an FPGA (Field-Programmable Gate Array) device commonly used in applications such as telecommunications, networking, and industrial automation. It is used to implement digital logic functions and perform tasks such as data processing, encryption, and signal conversion in these areas.

• Package

  The XCV100E-6BGG352C chip comes in a Ball Grid Array (BGA) package type. It is in the form of a square with the dimensions of 35.2mm x 35.2mm.