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$5000Xilinx XC7Z030-1FFG676I
FPGA Zynq®-7000 Family 125000 Cells 28nm Technology 1V Automotive 676-Pin FCBGA
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Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC7Z030-1FFG676I
Ficha de dados: XC7Z030-1FFG676I Datasheet (PDF)
Pacote/Caso: FCBGA-676
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2.436 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7Z030-1FFG676I Descrição geral
The XC7Z030-1FFG676I is a standout product in the Zynq Family 7000 Series, featuring a robust Arm Cortex-A9 core architecture and a speedy 667Mhz CPU. Its Fcbga-676 case style accommodates the 676 pins, allowing for seamless integration and connectivity in various applications. As part of the Zynq MPU family, this microprocessor is built with cutting-edge technology and automotive ROHS compliance, ensuring high performance and environmental responsibility. Whether used in automotive or other industries, the XC7Z030-1FFG676I delivers reliable processing power and efficiency
Características
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 676-FCBGA (27x27)Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 676-FCBGA (27x27)Aplicativo
- The XC7Z030-1FFG676I is commonly used in various embedded processing applications, such as:
- Industrial automation and control systems
- Automotive electronics
- Video and image processing systems
- High-performance computing
- Aerospace and defense systems
- Medical devices
- IoT (Internet of Things) applications
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Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Name | XC7Z030-1FFG676I | Product Type | Field-Programmable Gate Array |
Manufacturer | Xilinx | Series | Zynq-7000 |
Technology | 28nm | Logic Cells | 154K |
CLB Logic | 9600 | DSP Slices | 360 |
Block RAM | 1.5MB | Max User I/O | 355 |
Max User Memory | 53,248KB | Internal Flash | Not available |
Operating Temperature | -40°C to 100°C |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa5 :Caixas de embalagem
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Peças Equivalentes
Para o XC7Z030-1FFG676I componente, você pode considerar essas peças de reposição e alternativas:
Número da peça
Marcas
Pacote
Descrição
Número da peça : XC7Z030-1FFG676I
Marcas :
Pacote : 676-BBGA, FCBGA
Descrição : Since the XC7Z030-1FFG676I is a specific model from Xilinx, there are no exact equivalent parts from other manufacturers. However, there may be alternative FPGA devices with similar features and capabilities available from competitors such as Intel (formerly Altera), Microchip, or Lattice Semiconductor. It is recommended to consult datasheets and technical specifications to identify the most suitable alternative for specific application requirements.
Part points
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XC7Z030-1FFG676I is a high-performance System on Chip (SoC) from Xilinx's Zynq-7000 series. It features a dual-core ARM Cortex-A9 processor, programmable logic for custom hardware acceleration, and a wide range of peripherals for connectivity and interfacing. The chip is ideal for applications requiring high processing power and flexibility in a compact form factor.
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Equivalent
The equivalent products of XC7Z030-1FFG676I chip are XC7Z030-1SBG485I and XC7Z020-1CLG484I chips. These chips have similar features and specifications, such as being part of the Zynq-7000 family of SoCs and having a high-performance ARM Cortex-A9 processor and FPGA fabric. -
Features
The XC7Z030-1FFG676I is a high-performance System-on-Chip (SoC) device with a dual-core ARM Cortex-A9 processor, programmable logic with 85,000 logic cells, and integrated peripherals such as gigabit Ethernet, USB, and DDR3 memory controller. It also has high-speed transceivers and supports various communication protocols. -
Pinout
XC7Z030-1FFG676I is a Field Programmable Gate Array (FPGA) with 676 pins. It has a dual-core ARM Cortex-A9 processor, programmable logic, and input/output interfaces for communication and control. This device is commonly used in applications that require high-performance computing and flexibility in configuration. -
Manufacturer
XC7Z030-1FFG676I is manufactured by Xilinx, Inc., which is a semiconductor company specializing in the development of programmable logic devices and associated software tools. Xilinx is known for its field-programmable gate arrays (FPGAs) and intellectual property cores that enable customers to create customized designs for a variety of industries. -
Application Field
The XC7Z030-1FFG676I is widely used in industrial automation, automotive, telecommunications, and networking applications. It is often utilized for high-performance processing, power-efficient computing, and real-time processing tasks. Additionally, it is commonly found in military applications, medical devices, and aerospace systems due to its reliability and performance capabilities. -
Package
The XC7Z030-1FFG676I chip is in the BGA package type, with 676 pins arranged in a 27mm x 27mm form factor.
Ficha de dados PDF
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