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Xilinx XC7A75T-2FGG676I
The XC7A75T-2FGG676I is a versatile programmable logic device in a FBGA-676 package, suitable for CPLDs/FPGAs applications
Marcas: Amd
Parte do fabricante #: XC7A75T-2FGG676I
Ficha de dados: XC7A75T-2FGG676I Datasheet (PDF)
Pacote/Caso: FBGA-676
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2602 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaXC7A75T-2FGG676I Descrição geral
The XC7A75T-2FGG676I is a Xilinx Artix-7 FPGA with 75,000 logic cells and 2000 slices. It features up to 160 user I/Os, 6 clock tiles, and 410 GMACs of DSP slice performance. This FPGA also includes 400KB of block RAM, 25MB of distributed RAM, and 473KB of UltraRAM. With a maximum operating frequency of 450MHz, the XC7A75T-2FGG676I offers versatile connectivity options through its integrated transceivers, supporting various protocols such as PCIe, GbE, and SATA. It also provides advanced security features such as AES encryption and device DNA authentication to protect sensitive data and intellectual property. This FPGA is designed for a wide range of applications, including industrial automation, aerospace, telecommunications, and automotive. Its low power consumption and high performance make it suitable for applications that require real-time processing and high-speed data transfer. The XC7A75T-2FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FGGB) package, making it easy to integrate into existing designs. It is programmed using Xilinx's Vivado design suite, which provides a comprehensive development environment for designing, verifying, and implementing FPGA designs.
Características
- 7 Series FPGA - artix-7 Family
- 75840 Cells
- 500 MHz Maximum Frequency
- 675 I/Os
- 0.9V to 1.1V Voltage - Supply
- 676-BBGA, FCBGA Package
- 12844-LUTs
- 17300Kbits Memory Size
- 2-Input LUT Logic Cells
- 1.08V Operating Voltage
Aplicativo
- Industrial automation
- Medical equipment
- Communications
- Consumer electronics
- Automotive
- Aerospace
- Defense
- Video and image processing
- Data center
- Networking
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC7A75T | Number of Logic Elements | 75520 LE |
| Adaptive Logic Modules - ALMs | 11800 ALM | Embedded Memory | 3.69 kbit |
| Number of I/Os | 300 I/O | Supply Voltage - Min | 950 mV |
| Supply Voltage - Max | 1.05 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Data Rate | 6.6 Gb/s |
| Number of Transceivers | 8 Transceiver | Mounting Style | SMD/SMT |
| Package / Case | FBGA-676 | Brand | AMD / Xilinx |
| Distributed RAM | 892 kbit | Embedded Block RAM - EBR | 3780 kbit |
| Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 5900 LAB |
| Operating Supply Voltage | 1 V | Product Type | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
| Tradename | Artix |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
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Part points
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The XC7A75T-2FGG676I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Artix-7 family and features a high-performance logic fabric, integrated memory blocks, and configurable I/O resources. The chip is commonly used in various applications such as automotive, industrial automation, and telecommunications due to its versatility, programmability, and low power consumption.
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Equivalent
The equivalent products of the XC7A75T-2FGG676I chip are: 1. XC7A75T-2FGG484I (same chip with a different package) 2. XC7A75T-2FBG484I (same chip with a different package) 3. XC7A75T-2FGG676E (same chip with a different temperature range) 4. XC7A75T-2FGG676C (same chip with a different temperature range) 5. Other variants of the XC7A75T FPGA series from Xilinx may also serve as equivalents depending on specific requirements. -
Features
XC7A75T-2FGG676I is a member of the Xilinx Artix-7 FPGA series. It features 52,160 logic cells, 2.4 Mb distributed RAM, 62 DSP slices, and up to six clock management tiles for high-performance applications. It offers a maximum of 550 MHz operating frequency and supports advanced interfaces like PCIe, Gigabit Ethernet, USB, and more. -
Pinout
The XC7A75T-2FGG676I is a Field Programmable Gate Array (FPGA) with a pin count of 676. It has various functions, including logic and arithmetic operations, memory storage, and input/output interfaces. -
Manufacturer
The manufacturer of the XC7A75T-2FGG676I is Xilinx. Xilinx is a leading semiconductor company that specializes in the development and production of programmable logic devices and related technologies. -
Application Field
The XC7A75T-2FGG676I is FPGA (Field-Programmable Gate Array) primarily used in high-performance and low-power applications such as aerospace and defense systems, automotive electronics, industrial automation, and data centers. It offers a wide range of programmable logic, memory, and digital signal processing capabilities, making it suitable for various complex applications. -
Package
The XC7A75T-2FGG676I chip has a package type of Flip Chip, a form of BGA (Ball Grid Array) and comes in a size of 676 (27x27 mm).
Ficha de dados PDF
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