Xilinx XC6SLX16-3CSG324C

Part points

• The XC6SLX16-3CSG324C chip is a Field Programmable Gate Array (FPGA) from Xilinx. It belongs to the Spartan-6 family and has 16,384 logic cells, enabling the implementation of complex digital circuits. The -3 speed grade indicates it operates at a maximum frequency of 330 MHz. The CSG324C package type features 324 pins. Overall, this chip is ideal for applications that require high-performance and flexibility in circuit design.

• Equivalent

  A few equivalent products of the XC6SLX16-3CSG324C chip are: - Xilinx XC6SLX16-3FTG256C - Xilinx XC6SLX16-3TQG144C - Xilinx XC6SLX16-2CSG225C - Xilinx XC6SLX16-3CSG225I - Xilinx XC6SLX16-3CSG225C These chips have similar specifications and functionality to the XC6SLX16-3CSG324C chip but may differ in package type or speed grade.

• Features

  The XC6SLX16-3CSG324C is a field-programmable gate array (FPGA) with 16,384 logic cells and 4832 slices. It operates at a maximum frequency of 275 MHz and has a 16-bit configurable block RAM. It also features built-in system-level blocks like digital clock managers, global clock distribution, and dynamic I/O.

• Pinout

  The XC6SLX16-3CSG324C is a Field Programmable Gate Array (FPGA) with 324 pins. It belongs to the Spartan-6 family and has a total of 49 configurable I/O pins, along with several power and ground pins. The specific functions of the pins vary depending on the configuration of the FPGA.

• Manufacturer

  The XC6SLX16-3CSG324C is manufactured by Xilinx Inc. It is a technology company that specializes in the development of programmable logic devices, such as field-programmable gate arrays (FPGAs) and related software tools.

• Application Field

  The XC6SLX16-3CSG324C is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, automotive, industrial automation, aerospace, and defense. It is designed to implement digital logic circuits and perform complex computations, making it suitable for versatile applications across different industries.

• Package

  The XC6SLX16-3CSG324C chip comes in the form of a 324-pin plastic ball grid array (PBGA) package.