Xilinx XC6SLX100-2FGG484C

Part points

• The XC6SLX100-2FGG484C is a field programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 LX family and features 100,000 logic cells. It operates at a speed grade of -2 and has a FineLine BGA package with a 484-pin count. The chip is widely used in various applications, including telecommunications, automotive, and industrial sectors, where high-performance processing and flexibility are required.

• Equivalent

  There are no direct equivalent products to the XC6SLX100-2FGG484C chip as it is a unique part. However, alternative options may include similar Xilinx Spartan-6 field programmable gate array (FPGA) chips with different specifications, such as the XC6SLX100-2CSG324C or the XC6SLX100-2CSG484C.

• Features

  XC6SLX100-2FGG484C is a field-programmable gate array (FPGA) with 100,016 logic cells, 6.7 Mb of block RAM, and 576 dsp slices. It operates at a maximum speed of 550 MHz and has a 1.2V core voltage. It is housed in a 484-pin fine-pitch ball grid array (FBGA) package.

• Pinout

  The XC6SLX100-2FGG484C is a field-programmable gate array (FPGA) device. It has a pin count of 484 and is part of the Spartan-6 family from Xilinx. The specific functions and features of this device can be found in the datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC6SLX100-2FGG484C is Xilinx Inc. Xilinx is a leading American technology company specializing in the development, manufacturing, and distribution of programmable logic devices and related technologies. They are known for their field-programmable gate array (FPGA) and SoC products, providing solutions for various industries including aerospace, automotive, industrial, and telecommunications.

• Application Field

  The XC6SLX100-2FGG484C is a field-programmable gate array (FPGA) device. It can be used in various application areas, including industrial automation, telecommunications, aerospace, defense, medical devices, and automotive electronics. Its high-performance capabilities and flexibility make it suitable for a wide range of applications requiring customizable hardware solutions.

• Package

  The XC6SLX100-2FGG484C chip uses the FG (Fine-Pitch Ball Grid Array) package type. It has a 484-pin BGA (Ball Grid Array) form, and its size is 23 x 23 mm.