Xilinx XC3S1600E-4FGG484C
XILINX XC3S1600E-4FGG484C FPGA, SPARTAN-3E, 1600K GATES, 484FBGA
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC3S1600E-4FGG484C
Ficha de dados: XC3S1600E-4FGG484C Datasheet (PDF)
Pacote/Caso: 484-BBGA
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2802 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaXC3S1600E-4FGG484C Descrição geral
FPGA, SPARTAN-3E, 1600K GATES, 484FBGA; No. of Logic Blocks:4408; No. of Gates:1600000; No. of Macrocells:33192; Family Type:Spartan-3E; No. of Speed Grades:4; Series:Spartan-3E; Total RAM Bits:700416; No. of I/O's:376; Clock Management:DLL; Core Supply Voltage Range:1.14V to 1.26V; Operating Frequency Max:240MHz; Operating Temperature Range:0°C to +85°C; Logic Case Style:FBGA; No. of Pins:484; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Frequency:572MHz; I/O Interface Standard:LVTTL, LVCMOS, HSTL, SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; Logic IC Base Number:3S1600; Logic IC Function:FPGA; No. of I/O's:376; Operating Frequency Max:240MHz; Package / Case:FBGA; Programmable Logic Type:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD
Características
- 1,600,000 system gates
- 43,008 logic cells
- 1,296 Kbits of Block RAM
- 4 Digital Clock Managers (DCMs)
- 20 SelectIO™ technology-compatible channels
- 484-pin Fine-Pitch Ball-Grid Array (FBGA) package
- -4 speed grade (meaning it can operate at a maximum frequency of 400MHz)
Aplicativo
- High-speed communication systems
- Image processing and video applications
- Aerospace and defense systems
- Industrial automation and control systems
- Medical imaging and instrumentation
- Test and measurement equipment
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S1600E |
Number of Logic Elements: | 33192 LE | Adaptive Logic Modules - ALMs: | 14752 ALM |
Embedded Memory: | 648 kbit | Number of I/Os: | 376 I/O |
Supply Voltage - Min: | 1.14 V | Supply Voltage - Max: | 1.26 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | - | Number of Transceivers: | - |
Mounting Style: | SMD/SMT | Package / Case: | FCBGA-484 |
Brand: | Xilinx | Distributed RAM: | 231 kbit |
Embedded Block RAM - EBR: | 648 kbit | Maximum Operating Frequency: | 300 MHz |
Moisture Sensitive: | Yes | Number of Gates: | 1600000 |
Operating Supply Voltage: | 1.2 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC3S1600E-4FGG484C chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Spartan-3E FPGA family and has 1,600,000 system gates. This chip is highly versatile and can be configured to perform a wide range of functions. Its FG484 package type allows for easy integration into electronic systems.
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Equivalent
Equivalent products of the XC3S1600E-4FGG484C chip include XCS20XL-4FGG484C, XCS30XL-4FGG484C and XCS40XL-4FGG484C manufactured by Xilinx. -
Features
The XC3S1600E-4FGG484C is a field-programmable gate array (FPGA) with 1,600,000 system gates. It utilizes 90nm technology and has 484 pins. The device provides excellent performance, low power consumption, and flexible usage due to its FPGA architecture. -
Pinout
The XC3S1600E-4FGG484C is a Field Programmable Gate Array (FPGA) from the Spartan-3E series by Xilinx. It has a pin count of 484, which refers to the number of input and output pins available on the device. The specific functions of each pin depend on the configuration of the FPGA and the design implemented on it. -
Manufacturer
The manufacturer of the XC3S1600E-4FGG484C is Xilinx. It is a semiconductor manufacturing company specializing in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and system on chips (SoCs). -
Application Field
The XC3S1600E-4FGG484C is a high-density field-programmable gate array (FPGA) that can be used in a variety of applications, including telecommunications, wireless networking, industrial automation, automotive, and defense. It offers a large number of logic cells and I/O pins, making it suitable for complex designs that require high-performance and reconfigurability. -
Package
The package type of the XC3S1600E-4FGG484C chip is BGA (Ball Grid Array). The form is FPGA (Field-Programmable Gate Array). The size of the chip is 484 balls (pins) in a 23mm x 23mm grid.
Ficha de dados PDF
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