Xilinx XC3S1600E-4FGG400C
600000 Gate FPGA with a clock speed of 572MHz
Marcas: Amd
Parte do fabricante #: XC3S1600E-4FGG400C
Ficha de dados: XC3S1600E-4FGG400C Datasheet (PDF)
Pacote/Caso: FBGA-400
Status RoHS:
Condição de estoque: 3824 peças, novo original
Tipo de Produto: CIs lógicos programáveis
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $691,009 | $691,009 |
180 | $275,718 | $49629,240 |
480 | $266,504 | $127921,920 |
1020 | $261,952 | $267191,040 |
In Stock:3824 PCS
XC3S1600E-4FGG400C Descrição geral
The XC3S1600E-4FGG400C is a member of the Xilinx Spartan-3E FPGA family, designed for high-performance, low-power applications. It features 1.6 million system gates, 376 I/O pins, and 168 user I/O pins. The device operates at a maximum frequency of 400 MHz and is packaged in a 400-pin Fine-Pitch Ball Grid Array (FBGA).The XC3S1600E-4FGG400C offers various built-in features that enhance its functionality, including integrated PowerPC hard blocks and embedded multipliers. It also includes 18 x 18-bit multipliers, 4 DLLs, and 2 DCMs. The device supports configuration over a JTAG interface and has an integrated IEEE 1149.1 (JTAG) test access port.The Spartan-3E FPGA family is known for its low power consumption, making it suitable for battery-operated devices and other power-sensitive applications. It also offers high-speed performance and reliability, making it a popular choice for a wide range of applications in industries such as communications, automotive, consumer electronics, and industrial control.
Características
- Manufacturer: Xilinx
- Series: Spartan-3E
- Logic Elements: 1,200,000
- Number of Logic Cells: 76,800
- Number of I/Os: 381
- Operating Frequency: 450 MHz
Aplicativo
- Telecommunications
- Networking equipment
- Industrial control systems
- Automotive applications
- Medical devices
- Consumer electronics
- Security systems
- Military and aerospace applications
- Data storage
- Vision systems
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC3S1600E | Number of Logic Elements | 33192 LE |
Number of I/Os | 304 I/O | Supply Voltage - Min | 1.2 V |
Supply Voltage - Max | 1.2 V | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Data Rate | 333 Mb/s |
Mounting Style | SMD/SMT | Package / Case | FBGA-400 |
Brand | AMD / Xilinx | Distributed RAM | 231 kbit |
Embedded Block RAM - EBR | 648 kbit | Maximum Operating Frequency | 300 MHz |
Moisture Sensitive | Yes | Number of Gates | 1600000 |
Operating Supply Voltage | 1.2 V | Product Type | FPGA - Field Programmable Gate Array |
Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
Tradename | Spartan |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) made by Xilinx. It belongs to the Spartan-3E FPGA family and offers 1.6 million system gates, 1536 logic cells, and 40,960 bits of block RAM. It operates at a maximum speed of 400 MHz and is mounted on a 400-ball fine-pitch ball grid array (FBGA) package. The XC3S1600E-4FGG400C is commonly used in various electronic applications requiring high-speed processing and programmability.
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Equivalent
There are no directly equivalent products to the XC3S1600E-4FGG400C chip. However, other Xilinx Spartan-3E FPGA chips with similar characteristics may be considered for similar applications, such as the XC3S1600E-4FGG320C or the XC3S200E-4FGG320C. -
Features
The XC3S1600E-4FGG400C is a field-programmable gate array (FPGA) with 1,576 slices, 98,304 logic cells, and 905Kbits of RAM. It offers a maximum of 1.6 million system gates, 800 MHz maximum operating frequency, integrated block RAM, and high-performance serial connectivity. Additionally, it provides ample programmable interconnect resources and is suitable for various applications. -
Pinout
The pin count of the XC3S1600E-4FGG400C is 400. It is an FPGA (Field-Programmable Gate Array) with a capacity of 1,600,000 system gates and 1,084 equivalent logic cells. It is designed to implement digital logic functions and can be reprogrammed to fit specific applications. -
Manufacturer
XC3S1600E-4FGG400C is manufactured by Xilinx. Xilinx is a prominent American technology company specializing in the development and production of programmable logic devices (PLDs), particularly Field-Programmable Gate Arrays (FPGAs). Xilinx is recognized as a leader in the FPGA market and provides innovative solutions for various applications, including telecommunications, automotive, aerospace, and more. -
Application Field
The XC3S1600E-4FGG400C is commonly used in a variety of application areas such as telecommunications, automotive, industrial automation, consumer electronics, and aerospace. It can be used for tasks such as digital signal processing, image and video processing, network communication, and control systems. -
Package
The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) with a FBGA package type. Its form is BGA (Ball Grid Array) and it has a size of 400 balls.
Ficha de dados PDF
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