Xilinx XC3S1500-4FGG456C

Part points

• The XC3S1500-4FGG456C chip is an FPGA (Field-Programmable Gate Array) from the Xilinx Spartan-3 family. It has a capacity of 1.5 million system gates and is manufactured on a 90nm process. It features high performance and low power consumption, making it suitable for a wide range of applications in areas like telecommunications, automotive, and industrial control.

• Equivalent

  XC3S1500-4FGG456C is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. There are no direct equivalent products since each FPGA chip has its own specifications and characteristics. However, alternatives to consider could be other Xilinx FPGA chips with similar features or chips from competing manufacturers such as Altera or Lattice Semiconductor.

• Features

  XC3S1500-4FGG456C is a field-programmable gate array (FPGA) device. It has a capacity of 1,553,600 system gates, with 1,536 CLB slices and 352 I/O pins. It operates on a speed grade of -4 and comes in a package size of 456-ball Fine-Pitch BGA.

• Pinout

  The XC3S1500-4FGG456C is a 456-ball BGA package that belongs to the family of Spartan-3 FPGAs. It has a pin count of 456 pins and includes various functionality such as programmable logic gates, configurable flip-flops, block RAM, multiplexers, and I/O blocks. These features enable the device to be customized for specific applications.

• Manufacturer

  The manufacturer of the XC3S1500-4FGG456C is Xilinx. Xilinx is a semiconductor company that specializes in the development and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs) and high-performance integrated circuits.

• Application Field

  The XC3S1500-4FGG456C is commonly used in various applications such as automotive, industrial automation, wireless communications, and defense and aerospace systems. It offers high performance and flexibility, making it suitable for a wide range of applications that require programmable logic devices.

• Package

  The XC3S1500-4FGG456C chip has a BGA package type, a grid array form, and a size of 456 balls (or pins).