Xilinx XC2S200-5FGG256I

Part points

• The XC2S200-5FGG256I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-2 family and has a capacity of 200,000 system gates. It operates at a speed grade of 5 and comes in a Fine-Pitch Ball Grid Array (FGGBA) package with 256 pins. This FPGA chip offers advanced programmability and is commonly used in a variety of applications, including telecommunications, consumer electronics, and automotive industries.

• Equivalent

  The equivalent products of the XC2S200-5FGG256I chip are the XC2S200E-5FGG256I, XC2S200-4FGG256I, XC2S200E-6FGG256I, XC2S200E-7FGG256I, XC2S200E-8FGG256I, XC2S200E-4FGG256I, and XC2S200-6FGG256I.

• Features

  The XC2S200-5FGG256I is a Field-Programmable Gate Array (FPGA) with a capacity of 200,000 system gates. It operates at a speed grade of -5, with a maximum frequency of 267 MHz. It is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.

• Pinout

  The XC2S200-5FGG256I is a field-programmable gate array (FPGA) with a pin count of 256. It is designed to perform various logic functions and can be reprogrammed to suit different applications.

• Manufacturer

  The manufacturer of the XC2S200-5FGG256I is Xilinx Inc. Xilinx is a leading American technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC2S200-5FGG256I is a Field-Programmable Gate Array (FPGA) device. It can be used in various application areas such as aerospace, automotive, telecommunications, industrial automation, and consumer electronics. Its features, including high-speed performance, low power consumption, and reconfigurability, make it suitable for a wide range of applications.

• Package

  The XC2S200-5FGG256I chip has a BGA package type, a form factor of 256-ball grid array (BGA), and a size of 17 by 17 mm.