Xilinx XC2S200-5FGG256C

Part points

• The XC2S200-5FGG256C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It is part of the Spartan-2 family and offers 200,000 system gates. The -5 speed grade indicates that it operates at a maximum frequency grade of 5, allowing for fast processing speeds. The FGG256C package has 256 pins. Overall, this chip is designed for high-performance applications with flexible programmability.

• Equivalent

  Some equivalent products of the XC2S200-5FGG256C chip are the XC2S200-5FG256C, XC2S200E-5FG256C, XC2S200-5FG256I, and XC2S200-5FTG256C.

• Features

  XC2S200-5FGG256C is a field-programmable gate array (FPGA) from Xilinx. It has a 200,000-gate capacity with 254 logic cells, 4 dedicated multipliers, and 1920 slices. It operates at a maximum frequency of 213 MHz and offers 256-ball Fine-Pitch Ball-Grid Array (FPBGA) packaging.

• Pinout

  The XC2S200-5FGG256C is an FPGA (Field-Programmable Gate Array) with a pin count of 256. It has various functions such as configurable logic blocks, digital signal processing blocks, memory blocks, and input/output pads.

• Manufacturer

  The manufacturer of the XC2S200-5FGG256C is Xilinx. Xilinx is a semiconductor company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XC2S200-5FGG256C is a field-programmable gate array (FPGA) that has various application areas including industrial automation, aerospace and defense, telecommunications, automotive, and consumer electronics. It can be used for tasks such as data processing, signal processing, system control, and communication protocol implementation.

• Package

  The XC2S200-5FGG256C chip has a package type of Flip-Chip Fine Grid Array (FC-FGA). Its form is BGA (Ball Grid Array), and the size of the chip is 17mm x 17mm.