Xilinx XC2S200-5FG256C

Part points

• The XC2S200-5FG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Xilinx Spartan-3 family and has 200,000 system gates and 92,160 available logic cells. It operates at a speed grade of -5 and comes in a Fine-Pitch Ball Grid Array (FBGA) package with 256 pins. The chip offers a programmable logic solution for a wide range of applications in various industries.

• Equivalent

  Some equivalent products to the XC2S200-5FG256C chip are XC2S200-5FGG256C, XC2S200-5FG256I, and XC2S200-5TQ144C. These chips are part of the XC2S200 series and have similar specifications and functionality.

• Features

  The XC2S200-5FG256C is a field-programmable gate array (FPGA) with a capacity of 200,000 system gates. It operates at a speed grade of 5, meaning it can handle up to 208.33 MHz clock frequency. The package type is FBGA (Fine-Pitch Ball Grid Array) with 256 pins.

• Pinout

  The XC2S200-5FG256C is an FPGA with a 256-pin Fine Pitch Ball Grid Array (FPBGA) package. It has 200 user I/O pins and additional pins for power, ground, configuration, and other functions.

• Manufacturer

  The XC2S200-5FG256C is manufactured by Xilinx Inc., an American technology company that focuses on the development and production of programmable logic devices and associated software tools. Xilinx is one of the leading manufacturers and suppliers in the field of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs).

• Application Field

  The XC2S200-5FG256C is a field-programmable gate array (FPGA) that can be used in a variety of applications such as aerospace and defense, automotive, industrial automation, medical equipment, and telecommunications. It offers high performance and flexibility, allowing for the customization and optimization of digital logic designs.

• Package

  The XC2S200-5FG256C chip is a field-programmable gate array (FPGA) in a 256-pin Fine-pitch Ball Grid Array (FBGA) package. It has a size of 17mm x 17mm.