Xilinx XC2S100-5FG256C

Part points

• The XC2S100-5FG256C chip is an integrated circuit from the Xilinx Spartan-II family. It is an FPGA (field-programmable gate array) device with a capacity of 100,000 system gates and contains various logic elements and programmable interconnects. The chip operates at a speed grade of 5 and is housed in a 256-ball Fine-pitch Ball Grid Array (FBGA) package.

• Equivalent

  There are no direct equivalent products of the XC2S100-5FG256C chip. However, Xilinx offers a range of other Spartan-2 FPGAs that may have similar features and capabilities, such as the XC2S150-5FG256C or XC2S200-5FG256C. It is recommended to consult the Xilinx product documentation or contact their sales team for more information.

• Features

  The XC2S100-5FG256C is a field-programmable gate array (FPGA) with 100K system gates and 4,608 logic cells. It operates at a speed grade of -5 and comes in a 256-pin FineLine BGA package. It offers 136 user I/O pins, two global clock and 14 dedicated input pins, and also supports both LVCMOS and LVTTL I/O standards.

• Pinout

  The XC2S100-5FG256C is an FPGA (Field Programmable Gate Array) with a pin count of 256. It has various functions, including digital signal processing, high-performance computing, and system-level integration. It is designed for general-purpose applications and offers a range of features like large capacity and high-speed clocking.

• Manufacturer

  The manufacturer of the XC2S100-5FG256C is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). Xilinx is considered a leader in the FPGA market and provides solutions for a wide range of applications, including data centers, telecommunications, automotive, and industrial sectors.

• Application Field

  The XC2S100-5FG256C is a Field-Programmable Gate Array (FPGA) commonly used in various application areas, including telecommunications, industrial automation, medical devices, aerospace, and defense. Its features and capabilities make it suitable for a wide range of applications, offering high performance, flexibility, and customization possibilities.

• Package

  The XC2S100-5FG256C chip comes in a Fine-Pitch Ball Grid Array (FBGA) package type. It has a 256-ball grid array form, and its size is referred to as 15x15mm.