Pedidos acima de
$5000
H5TQ4G63EFR-RDC
DDR DRAM,
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marcas: SK HYNIX INC
Parte do fabricante #: H5TQ4G63EFR-RDC
Ficha de dados: H5TQ4G63EFR-RDC Ficha de dados (PDF)
Pacote/Caso: TFBGA
Status RoHS:
Condição de estoque: 6.554 peças, novo original
Tipo de Produto: DRAMs
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $2,853 | $2,853 |
10 | $2,503 | $25,030 |
30 | $2,283 | $68,490 |
160 | $1,892 | $302,720 |
480 | $1,792 | $860,160 |
960 | $1,747 | $1677,120 |
Em estoque: 6.554 PCS
H5TQ4G63EFR-RDC Descrição geral
The H5TQ2G43CFR-xxC, H5TQ2G83CFR-xxC are a 2,147,483,648-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.
Características
VDD=VDDQ=1.5V +/- 0.075V Fully differential clock inputs (CK, CK) operation Differential Data Strobe (DQS, DQS) On chip DLL align DQ, DQS and DQS transition with CKtransition DM masks write data-in at the both rising and fallingedges of the data strobe All addresses and control inputs except data,data strobes and data masks latched on therising edges of the clock Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported Programmable additive latency 0, CL-1, and CL-2supported Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10 Programmable burst length 4/8 with both nibblesequential and interleave mode BL switch on the fly 8banks Average Refresh Cycle (Tcase of0 oC~ 95oC)- 7.8 s at 0oC ~ 85 oC- 3.9 s at 85oC ~ 95 oC JEDEC standard 78ball FBGA(x4/x8) Driver strength selected by EMRS Dynamic On Die Termination supported Asynchronous RESET pin supported ZQ calibration supported TDQS (Termination Data Strobe) supported (x8 only) Write Levelization supported 8 bit pre-fetch This product in compliance with the RoHS directive.
Aplicativo
- Computing applications (such as desktop and laptop computers, servers, etc.)
- Networking equipment
- Embedded systems
- Consumer electronics (such as gaming consoles)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Name | H5TQ4G63EFR-RDC | Product Type | DDR3 SDRAM |
Manufacturer | Hynix | Memory Technology | Synchronous DRAM (SDRAM) |
Configuration | 4Gb x 8 | Interface | Parallel |
Voltage - Supply | 1.35V ~ 1.5V | Operating Temperature | 0°C ~ 95°C |
Mounting Type | Surface Mount |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The H5TQ4G63EFR-RDC chip is a type of DDR3 SDRAM memory chip, commonly used in electronic devices such as smartphones, tablets, and computer systems. It has a storage capacity of 4 gigabits (512 megabytes) and operates at a high speed, making it suitable for multitasking and data-intensive applications. It provides fast and efficient data storage and retrieval for improved device performance.
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Features
H5TQ4G63EFR-RDC is a 4Gb LPDDR4X SDRAM with a 3200Mbps data rate. It offers low power consumption, high bandwidth, and high density while maintaining fast performance. The memory module supports various applications in mobile devices, providing efficient multitasking and faster data processing capabilities. -
Pinout
The H5TQ4G63EFR-RDC is a DDR3 SDRAM chip. It has a pin count of 96 and is commonly used in electronic devices such as smartphones and tablets for storage and processing of data. Its function is to provide high-speed data transfer between the device and the memory, enabling efficient performance. -
Manufacturer
The manufacturer of the H5TQ4G63EFR-RDC is SK Hynix. SK Hynix is a South Korean company specializing in the production of semiconductors, memory solutions, and integrated circuits. -
Application Field
The H5TQ4G63EFR-RDC is a DDR3 SDRAM memory chip commonly used in electronic devices such as smartphones, tablets, and computers. It provides high-speed data transfer and storage capabilities, making it suitable for applications that require quick and reliable memory access, such as gaming, multimedia processing, and multitasking. -
Package
The H5TQ4G63EFR-RDC chip comes in a FBGA package type, has a width of 8mm x 10mm, and a thickness of 1.2mm.
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos