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$5000H5TQ4G63AFR-RDC
Reliable and efficient DRAM module for data storage and processi
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Marcas: Sk Hynix Inc
Parte do fabricante #: H5TQ4G63AFR-RDC
Ficha de dados: H5TQ4G63AFR-RDC Ficha de dados (PDF)
Pacote/Caso: FBGA-96
Tipo de Produto: Memória
Status RoHS:
Condição de estoque: 7.143 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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H5TQ4G63AFR-RDC Descrição geral
The H5TQ4G63AFR-RDC is a cutting-edge 4Gb LPDDR3 mobile DRAM chip crafted by SK Hynix, delivering superior performance and efficiency. Boasting a generous storage capacity of 4 gigabits and a lightning-fast operating speed of up to 1866MHz, this chip is tailor-made for the demands of modern mobile devices such as smartphones and tablets. Its ability to swiftly and effectively process data sets it apart from the competition, offering users a seamless and responsive experience
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Características
- Power Consumption: Low power operation
- Voltage Range: 1.2V to 1.35V
- Operating Frequency: Up to 1333MHz
- Data Transfer Rate: PC3-12800
Aplicativo
- Smart TV
- Augmented reality headset
- Robotics control unit
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | SK HYNIX INC | Part Package Code | BGA |
Package Description | TFBGA, BGA96,9X16,32 | Pin Count | 96 |
ECCN Code | EAR99 | HTS Code | 8542.32.00.36 |
Access Mode | MULTI BANK PAGE BURST | Access Time-Max | 0.195 ns |
Additional Feature | AUTO/SELF REFRESH | Clock Frequency-Max (fCLK) | 933 MHz |
I/O Type | COMMON | Interleaved Burst Length | 4,8 |
JESD-30 Code | R-PBGA-B96 | Length | 13 mm |
Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 96 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Organization | 256MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Sequential Burst Length | 4,8 | Standby Current-Max | 0.017 A |
Supply Current-Max | 0.225 mA | Supply Voltage-Max (Vsup) | 1.575 V |
Supply Voltage-Min (Vsup) | 1.425 V | Supply Voltage-Nom (Vsup) | 1.5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The H5TQ4G63AFR-RDC is a high-performance NAND flash memory chip commonly used in mobile devices, offering fast data transfer rates and high storage capacity. It's designed for applications requiring reliable and efficient storage solutions.
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Equivalent
Equivalent products to the H5TQ4G63AFR-RDC chip include: 1. Micron MT29F32G08CBACAWP-IT: 4Gb NAND Flash. 2. Samsung K4G80325FC-HC28: 4Gb LPDDR4X SDRAM. 3. SK Hynix H9HCNNN8GALUZR-NEH: 4Gb LPDDR4X SDRAM. -
Features
H5TQ4G63AFR-RDC is a DDR3 SDRAM chip with a capacity of 4 gigabits. It operates at a speed of 2133 MHz and is designed for mobile devices. It features low power consumption and a compact form factor, making it suitable for use in smartphones, tablets, and other portable electronics. -
Pinout
The H5TQ4G63AFR-RDC is a 4Gb LPDDR4 SDRAM with a 78-ball FBGA package. It has a 27-bit data bus with a supply voltage of 1.1V. The pin count is 78 pins. This memory chip is commonly used in mobile devices and offers high-performance and low power consumption. -
Manufacturer
The manufacturer of the H5TQ4G63AFR-RDC is SK Hynix. SK Hynix is a South Korean semiconductor company that specializes in the production of memory chips, including dynamic random-access memory (DRAM) and NAND flash memory. It's one of the world's largest memory chip manufacturers, competing with companies like Samsung and Micron. -
Application Field
The H5TQ4G63AFR-RDC is commonly used in mobile devices, such as smartphones and tablets, for its low power consumption and high data transfer rates. It's also suitable for automotive applications where reliability and performance are crucial, and in industrial and IoT devices where space constraints and energy efficiency are important considerations. -
Package
The H5TQ4G63AFR-RDC chip is packaged in a FBGA (Fine-pitch Ball Grid Array) format with a size of 8mm x 10mm.
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos