Xilinx XCZU9EG-2FFVC900I

Part points

• The XCZU9EG-2FFVC900I is a high-performance system on chip (SoC) from Xilinx's Zynq UltraScale+ family. It features a quad-core Arm Cortex-A53 processor, a dual-core Cortex-R5 real-time processor, and a programmable logic fabric. With integrated FPGA capabilities, this chip is ideal for a wide range of applications requiring high processing performance and programmable logic flexibility.

• Equivalent

  The equivalent products of XCZU9EG-2FFVC900I chip are Xilinx Zynq UltraScale+ MPSoC XCZU9EG-2FFVC1156I, XCZU9EG-2FFVB1156I, and XCZU9EG-1FFVC1156I. These chips offer similar features and performance capabilities for applications requiring high processing power and programmable logic integration.

• Features

  XCZU9EG-2FFVC900I is a Zynq UltraScale+ MPSoC from Xilinx, featuring a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 processor, programmable logic with up to 929K logic cells, and hardware acceleration for AI inference. It also includes high-speed interfaces like PCIe Gen3, USB 3.0, and Gigabit Ethernet.

• Pinout

  XCZU9EG-2FFVC900I is a 900-pin FPGA chip from Xilinx. It features a Zynq UltraScale+ MPSoC architecture with 9,520 DSP slices, various digital I/Os, memory interfaces, Ethernet controllers, and more. It is commonly used in high-performance computing, networking, and automotive applications.

• Manufacturer

  The manufacturer of XCZU9EG-2FFVC900I is Xilinx. Xilinx is a technology company specializing in the development of field-programmable gate arrays (FPGAs) and programmable logic devices for a variety of applications, including data centers, automotive, and aerospace industries.

• Application Field

  The XCZU9EG-2FFVC900I is a high-performance FPGA suitable for a variety of applications such as data center acceleration, machine learning, image processing, networking, and communications. It can also be used in industrial automation, automotive, aerospace, and defense industries for tasks requiring advanced processing capabilities and high-speed connectivity.

• Package

  The XCZU9EG-2FFVC900I chip comes in a package type called Flip Chip Ball Grid Array (FCBGA), with a form factor of 900-ball grid array. The size of the chip is 31mm x 31mm.