Xilinx XCZU6CG-2FFVC900I

Part points

• The XCZU6CG-2FFVC900I is a member of Xilinx's Zynq UltraScale+ MPSoC family, featuring a XCZU6CG FPGA and ARM Cortex A53/A72 cores. With integrated programmable logic and processing units, it offers high performance for a wide range of embedded applications. Its capabilities are further enhanced by various input/output interfaces, memory controllers, and DSP slices.

• Equivalent

  Some equivalent products of the XCZU6CG-2FFVC900I chip include XCZU6CG-2FFVC1156I, XCZU6EG-1FFVC900I, XCZU6EG-2FFVC900I, and XCZU6EG-1FFVC1156I. These chips are part of the Xilinx Zynq UltraScale+ family and offer similar features and capabilities for FPGA and MPSoC applications.

• Features

  XCZU6CG-2FFVC900I is a Zynq UltraScale+ MPSoC with 6 ARM Cortex-A53 cores, 4 ARM Cortex-R5 cores, and a Mali-400 MP2 GPU. It has 115K logic cells, 940 DSP slices, 6.25 Mb of BRAM, and supports DDR4 memory. It also includes 26.4 Gb/s transceivers, PCIe Gen3, and Gigabit Ethernet interfaces.

• Pinout

  XCZU6CG-2FFVC900I is a Zynq UltraScale+ Multiprocessor System on Chip (MPSoC) with 900 pin count. It features a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processor, Mali-400 MP2 GPU, and programmable logic fabric. It is suitable for applications that require high performance and flexibility.

• Manufacturer

  XCZU6CG-2FFVC900I is manufactured by Xilinx, an American technology company known for developing programmable logic devices and associated technologies. Xilinx specializes in the design and production of field-programmable gate arrays (FPGAs), providing solutions for a wide range of industries including aerospace, defense, automotive, telecommunications, and data center.

• Application Field

  XCZU6CG-2FFVC900I is a highly versatile System-on-Chip (SoC) that can be used in a variety of application areas such as automotive, industrial automation, aerospace, defense, and networking. It is well-suited for applications that require high-performance processing, FPGA programming, and integrated connectivity features.

• Package

  The XCZU6CG-2FFVC900I chip is in a flip-chip ball grid array (FCBGA) package with a size of 35mm x 35mm. It has a form factor of 900-pin and a fine pitch of 0.8mm, making it suitable for high-performance computing applications.