Pedidos acima de
$5000
Xilinx XCZU6CG-2FFVB1156I
System on Chip FPGA XCZU6CG-2FFVB1156I
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XCZU6CG-2FFVB1156I
Ficha de dados: XCZU6CG-2FFVB1156I Datasheet (PDF)
Pacote/Caso: FCBGA-1156
Status RoHS:
Condição de estoque: 3.417 peças, novo original
Tipo de Produto: CIs lógicos programáveis
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $1763,362 | $1763,362 |
30 | $1688,213 | $50646,390 |
Em estoque: 3.417 PCS
XCZU6CG-2FFVB1156I Descrição geral
Not only does this sophisticated device come packed with processing power, but it also integrates a plethora of interfaces and peripherals such as high-speed serial transceivers, DDR4 memory controllers, Gigabit Ethernet, USB, and PCIe, ensuring seamless connectivity and interaction with external components
Características
SoC FPGA XCZU6CG-2FFVB1156ISoC FPGA XCZU6CG-2FFVB1156I![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | SoC FPGA |
Shipping Restrictions: | This product may require additional documentation to export from the United States. | RoHS: | Details |
Mounting Style: | SMD/SMT | Package / Case: | FCBGA-1156 |
Core: | ARM Cortex A53, ARM Cortex R5 | Number of Cores: | 4 Core |
Maximum Clock Frequency: | 600 MHz, 1.5 GHz | L1 Cache Instruction Memory: | 2 x 32 kB, 2 x 32 kB |
L1 Cache Data Memory: | 2 x 32 kB, 2 x 32 kB | Program Memory Size: | - |
Data RAM Size: | - | Number of Logic Elements: | 469446 LE |
Adaptive Logic Modules - ALMs: | 26825.5 ALM | Embedded Memory: | 25.1 Mbit |
Number of I/Os: | 352 I/O | Operating Supply Voltage: | 850 mV |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Brand: | Xilinx | Distributed RAM: | 6.9 Mbit |
Embedded Block RAM - EBR: | 25.1 Mbit | Moisture Sensitive: | Yes |
Number of Logic Array Blocks - LABs: | 26825.5 LAB | Number of Transceivers: | 24 Transceiver |
Product Type: | SoC FPGA | Series: | XCZU6CG |
Factory Pack Quantity: | 1 | Subcategory: | SOC - Systems on a Chip |
Tradename: | Zynq UltraScale+ |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
![]() |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
![]() |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
![]() |
PayPal | cobrar taxa de serviço de 4,0%. |
![]() |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
![]() |
Western Union | charge US.00 banking fee. |
![]() |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
-
Etapa1 :produtos
-
Etapa2 :Embalagem a vácuo
-
Etapa3 :Saco antiestático
-
Etapa4 :Embalagem individual
-
Etapa5 :Caixas de embalagem
-
Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
-
The XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC chip from Xilinx, featuring a combination of FPGA fabric and ARM processor cores. It is designed for applications requiring high-performance processing, programmable logic, and integrated connectivity capabilities. The chip is ideal for a wide range of applications such as automotive, industrial automation, and networking.
-
Equivalent
The equivalent products of the XCZU6CG-2FFVB1156I chip are Xilinx's Zynq UltraScale+ XCZU7CG-2FFVC1156I, XCZU6CG-2FFVB900I, XCZU5EV-1FFVC900I, and XCZU5CG-1FFVC900I chips. These chips belong to the Zynq UltraScale+ MPSoC family and offer similar features and capabilities for different performance and power requirements. -
Features
XCZU6CG-2FFVB1156I is a Zynq UltraScale+ MPSoC with integrated FPGA and ARM processors, featuring 6 ARM Cortex-A53 cores, Mali-400 MP2 GPU, and a programmable logic capacity of 297K logic cells. It also includes 2.4Mb of Block RAM, 60Mb of UltraRAM, and interfaces like PCIe, Gigabit Ethernet, and USB. -
Pinout
The XCZU6CG-2FFVB1156I is a programmable System on Chip (SoC) with 1156 pins. It features a high-performance processing system, programmable logic, and integrated peripherals for a wide range of applications such as signal processing, networking, and industrial control. -
Manufacturer
XCZU6CG-2FFVB1156I is manufactured by Xilinx, which is a technology company specializing in the design and production of programmable logic devices. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and programmable System-on-Chip (SoC) solutions for a wide range of applications in industries such as automotive, aerospace, telecommunications, and data center. -
Application Field
The XCZU6CG-2FFVB1156I is a versatile SoC device commonly used in applications such as high-performance computing, data center acceleration, networking, and aerospace and defense systems. It is also used in industrial automation, automotive, and telecommunication equipment for its advanced processing capabilities and integrated features. -
Package
The XCZU6CG-2FFVB1156I chip is packaged in a Flip-Chip Ball Grid Array (FCBGA). It has a form factor of 35mm x 35mm and is in a size of 1156 pins.
Ficha de dados PDF
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
-
Temos produtos ricos que podem atender às suas diversas necessidades.
-
A quantidade mínima de pedido começa em 1 unidade.
-
A menor taxa de envio internacional começa em US$ 0,00
-
365 dias de garantia de qualidade para todos os produtos