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$5000Xilinx XCZU5CG-1FBVB900I
XCZU5CG-1FBVB900I is a member of the Zynq® UltraScale Family of FPGAs, boasting 256200 cells, manufactured using 20nm technology, running at 0
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Marcas: AMD Xilinx, Inc
Parte do fabricante #: XCZU5CG-1FBVB900I
Ficha de dados: XCZU5CG-1FBVB900I Datasheet (PDF)
Pacote/Caso: FBGA-900
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 3.062 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCZU5CG-1FBVB900I Descrição geral
The XCZU5CG-1FBVB900I represents a sophisticated integration of programmable logic, processing system, and peripherals on a single chip, making it a cost-effective and space-efficient solution for diverse embedded system designs. Whether used in industrial automation, automotive, aerospace, or telecommunications, this device empowers developers to achieve exceptional levels of performance, connectivity, and flexibility
Características
SoC FPGA XCZU5CG-1FBVB900ISoC FPGA XCZU5CG-1FBVB900I![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | Xilinx | Product Category: | SoC FPGA |
Shipping Restrictions: | This product may require additional documentation to export from the United States. | RoHS: | Details |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-900 |
Core: | ARM Cortex A53, ARM Cortex R5 | Number of Cores: | 4 Core |
Maximum Clock Frequency: | 600 MHz, 1.5 GHz | L1 Cache Instruction Memory: | 2 x 32 kB, 2 x 32 kB |
L1 Cache Data Memory: | 2 x 32 kB, 2 x 32 kB | Program Memory Size: | - |
Data RAM Size: | - | Number of Logic Elements: | 256200 LE |
Adaptive Logic Modules - ALMs: | 14640 ALM | Embedded Memory: | 5.1 Mbit |
Number of I/Os: | 220 I/O | Operating Supply Voltage: | 850 mV |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Brand: | Xilinx | Distributed RAM: | 3.5 Mbit |
Embedded Block RAM - EBR: | 5.1 Mbit | Moisture Sensitive: | Yes |
Number of Logic Array Blocks - LABs: | 14640 LAB | Number of Transceivers: | 16 Transceiver |
Product Type: | SoC FPGA | Series: | XCZU5CG |
Factory Pack Quantity: | 1 | Subcategory: | SOC - Systems on a Chip |
Tradename: | Zynq UltraScale+ |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XCZU5CG-1FBVB900I is a high-performance system on chip (SoC) from Xilinx, featuring a Zynq UltraScale+ MPSoC architecture. It combines the programmable logic of an FPGA with multiple application processors and real-time processing units. With high-speed interfaces and advanced processing capabilities, it is ideal for applications in areas such as industrial automation, automotive, and networking.
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Equivalent
The equivalent products of the XCZU5CG-1FBVB900I chip are XCZU5CG-1FFVB900E and XCZU5CG-1FLVB900E. These chips have similar specifications and functionality, making them suitable alternatives for the XCZU5CG-1FBVB900I in specific applications. -
Features
The XCZU5CG-1FBVB900I is a Zynq UltraScale+ MPSoC device from Xilinx. It features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, a Mali-400 MP2 GPU, and programmable logic. It also includes high-speed interfaces, DDR4 memory support, PCIe Gen3, and multiple 10 Gb/s transceivers. -
Pinout
The XCZU5CG-1FBVB900I is a Zynq UltraScale+ MPSoC with a 900-pin BGA package. It features a combination of programmable logic, ARM processors, memory interfaces, and IO peripherals, making it suitable for a wide range of applications in communications, automotive, industrial, and other markets. -
Manufacturer
The manufacturer of XCZU5CG-1FBVB900I is Xilinx Inc. Xilinx is an American technology company that specializes in programmable devices, including field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). They are known for their advanced semiconductor solutions which are used in a variety of applications including data centers, telecommunications, automotive, and aerospace industries. -
Application Field
The XCZU5CG-1FBVB900I is commonly used in applications such as high-performance computing, networking, data centers, and industrial automation. Its high processing power and programmable logic capabilities make it suitable for a wide range of applications requiring advanced computing and data processing capabilities. -
Package
The XCZU5CG-1FBVB900I chip is a Ball Grid Array (BGA) package type, with a form factor of 900-BBGA, and a size of 31mm x 31mm.
Ficha de dados PDF
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