Xilinx XCZU15EG-2FFVC900I

Part points

• The XCZU15EG-2FFVC900I is a high-performance system on chip (SoC) from Xilinx, featuring a Zynq UltraScale+ MPSoC architecture. It combines FPGA programmability with ARM processing power, making it suitable for a wide range of applications requiring high performance, flexibility, and integration. Its features include a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an extensive programmable logic fabric.

• Equivalent

  The equivalent products of XCZU15EG-2FFVC900I chip are XCZU15EG-2FFVC900E, XCZU15E-2FFVC900, and XCZU15EG-2FFVB900E. These chips have similar specifications, performance, and functionality as XCZU15EG-2FFVC900I.

• Features

  The XCZU15EG-2FFVC900I is a Zynq UltraScale+ MPSoC with 6 ARM Cortex-A53 cores, a Mali-400MP2 GPU, and UltraScale FPGA fabric. It offers a wide range of connectivity options, high-performance computing capabilities, and high-speed data processing. It also includes programmable logic for custom accelerators and flexible design options.

• Pinout

  The XCZU15EG-2FFVC900I is a Field Programmable Gate Array (FPGA) with 900 pins. It features a high-performance ARM Cortex-A53 processor, dual-core ARM Cortex-R5 real-time processors, Mali-400 MP2 GPU, programmable logic fabric, and programmable I/O peripherals for various applications such as video processing, 5G wireless communication, and automotive systems.

• Manufacturer

  The manufacturer of XCZU15EG-2FFVC900I is Xilinx. Xilinx is an American technology company that specializes in the design and production of field-programmable gate arrays (FPGAs) and other programmable logic devices.

• Application Field

  The XCZU15EG-2FFVC900I is ideal for a wide range of applications including data center acceleration, machine learning, artificial intelligence, autonomous driving, high-performance computing, and advanced signal processing. It is also suitable for use in telecommunications, aerospace, defense, and medical imaging industries.

• Package

  The XCZU15EG-2FFVC900I chip comes in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package. It has a form factor of 35mm x 35mm and a size of 900 square millimeters.