Xilinx XCV1600E-8FG860I

Part points

• The XCV1600E-8FG860I chip is an FPGA (Field Programmable Gate Array) designed by Xilinx. It offers high data processing capabilities and can be programmed to perform specific tasks. The chip contains programmable logic blocks, I/O interfaces, and other components that enable versatile applications. Its advanced features make it suitable for various industries like telecommunications, aerospace, and automotive.

• Features

  The XCV1600E-8FG860I has 1600 slices, 8 Mbit of embedded block RAM, and 860 I/O pins. It has a low-power programmable fabric with high-speed transceivers, built-in security features, DSP blocks, and advanced system-level blocks for efficient design integration. It is well-suited for high-performance applications that require a large number of logic slices and I/O pins.

• Pinout

  The XCV1600E-8FG860I is an FPGA (Field-Programmable Gate Array) with a pin count of 860. The specific functions of each pin can vary depending on the design and configuration of the FPGA during programming.

• Manufacturer

  The manufacturer of the XCV1600E-8FG860I is Xilinx Inc. It is an American technology company specializing in the development and manufacturing of programmable logic devices and associated technology.

• Application Field

  The XCV1600E-8FG860I is an FPGA (Field-Programmable Gate Array) ideal for high-performance computing tasks in areas such as data centers, cloud computing, network acceleration, and machine learning. It offers high-speed processing capabilities, versatile architecture, and low latency, making it suitable for applications requiring complex algorithm execution and real-time data processing.

• Package

  The XCV1600E-8FG860I chip is available in a Flip-Chip Ball Grid Array (FCBGA) package type, with a size of 860 balls. The specific form and dimensions of the chip have not been provided in the given information.