Xilinx XC7Z045-2FBG676I

Part points

• The XC7Z045-2FBG676I is a System on Chip (SoC) device from Xilinx that features a dual-core ARM Cortex-A9 processor and programmable logic in a single package. It offers high performance and flexibility for a wide range of applications including industrial automation, automotive electronics, and telecommunications.

• Equivalent

  The equivalent products of XC7Z045-2FBG676I chip are Xilinx XC7Z045-2FFG676I, XC7Z045-2FFG900I, and XC7Z045-2FFG676C.

• Features

  The XC7Z045-2FBG676I features a Dual-core ARM Cortex-A9 processor, programmable logic cells, DDR3 memory interface, USB, Ethernet, and PCIe connectivity options. It also offers up to 209k logic cells, 1225 DSP slices, and 1266 MB of memory for high-performance processing in embedded applications.

• Pinout

  The XC7Z045-2FBG676I is a System-on-Chip (SoC) device with a pin count of 676. It features a dual-core ARM Cortex-A9 processor, programmable logic cells, and various peripherals for high-performance embedded processing applications.

• Manufacturer

  The XC7Z045-2FBG676I is manufactured by Xilinx, Inc., a leading American company specializing in the development of semiconductor products, primarily focusing on programmable logic devices, such as field-programmable gate arrays (FPGAs) and systems on chips (SoCs). Xilinx also provides various design tools and IP cores to support their products.

• Application Field

  The XC7Z045-2FBG676I is commonly used in high-performance applications such as aerospace, defense, telecommunications, automotive, and industrial automation. Its advanced features and capabilities make it ideal for tasks requiring high processing power, such as image processing, signal processing, and data analytics.

• Package

  The XC7Z045-2FBG676I chip comes in a Ball Grid Array (BGA) package type with 676 pins. It is a 28nm Field Programmable Gate Array (FPGA) with a form factor of 676FBGA and a size of 676 pins.