Xilinx XC7Z035-2FFG900I

Part points

• The XC7Z035-2FFG900I chip is a versatile programmable system-on-chip (SoC) developed by Xilinx. It belongs to the Zynq-7000 family and features a dual-core ARM Cortex-A9 processor combined with programmable logic, enabling hardware and software integration on a single device. With its high-speed interfaces and ample logic resources, the chip offers powerful processing capabilities for a wide range of applications such as industrial automation, automotive, and networking.

• Features

  XC7Z035-2FFG900I is a system on a chip (SoC) by Xilinx. It features a Dual ARM Cortex A9 processor with NEON, a programmable logic, and includes built-in peripherals and interfaces like USB, Ethernet, and DDR3 memory. It operates at industrial temperature range and supports high-speed connectivity and secure boot options.

• Pinout

  The XC7Z035-2FFG900I is an integrated circuit (IC) with a pin count of 900. It is classified as a field-programmable gate array (FPGA) and its main function is to provide programmable logic and processing capabilities for various applications.

• Manufacturer

  The manufacturer of the XC7Z035-2FFG900I is Xilinx, Inc. It is an American technology company that specializes in designing and manufacturing programmable logic devices and associated development software.

• Application Field

  The XC7Z035-2FFG900I is a versatile field programmable gate array (FPGA) that can be used in various application areas such as aerospace and defense, automotive, industrial automation, and telecommunications. It is suitable for high-performance computing, signal processing, image and video processing, and other computationally intensive tasks.

• Package

  The XC7Z035-2FFG900I chip comes in a Ball Grid Array (BGA) package type. It has 900 ball contacts and is available in a form factor of 35mm x 35mm.