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$5000Xilinx XC7Z035-1FBG676I
Advanced system-on-chip solution for complex embedded systems development
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Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC7Z035-1FBG676I
Ficha de dados: XC7Z035-1FBG676I Datasheet (PDF)
Pacote/Caso: FCBGA-676
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2.036 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7Z035-1FBG676I Descrição geral
Featuring a 676-pin BGA package, the XC7Z035-1FBG676I is a standout member of the Xilinx Zynq-7000 family of SoCs. It boasts an 866MHz dual-core ARM Cortex-A9 processor and a robust FPGA fabric with 74k logic cells and 143k flip-flops, offering unparalleled flexibility for custom logic implementation. Additionally, the 1GB DDR3 SDRAM, 32k L1 instruction cache, and 32k L1 data cache ensure exceptional program performance and data storage. With a wide range of interfaces, including Gigabit Ethernet, USB 2.0, CAN, SPI, I2C, and UART, this SoC is well-suited for applications requiring networking capabilities and external device communication
Características
IC SOC CORTEX-A9 KINTEX7 676BGAIC SOC CORTEX-A9 KINTEX7 676BGA![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | Xilinx | Product Category: | SoC FPGA |
RoHS: | Details | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-676 | Core: | ARM Cortex A9 |
Number of Cores: | 2 Core | Maximum Clock Frequency: | 667 MHz |
L1 Cache Instruction Memory: | 2 x 32 kB | L1 Cache Data Memory: | 2 x 32 kB |
Program Memory Size: | - | Data RAM Size: | - |
Number of Logic Elements: | 275000 LE | Adaptive Logic Modules - ALMs: | 42975 ALM |
Embedded Memory: | 17.6 Mbit | Number of I/Os: | 250 I/O |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Brand: | Xilinx | Moisture Sensitive: | Yes |
Number of Logic Array Blocks - LABs: | 21487.5 LAB | Product Type: | Processors - Application Specialized |
Series: | XC7Z035 | Factory Pack Quantity: | 1 |
Subcategory: | SOC - Systems on a Chip |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC7Z035-1FBG676I is a high-performance System on Chip (SoC) from Xilinx, featuring a dual-core ARM Cortex-A9 processor and programmable logic for customizable hardware acceleration. It offers integrated peripherals, memory interface, and advanced connectivity options. This chip is designed for a wide range of applications in sectors such as industrial automation, automotive, and telecommunications.
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Equivalent
Some equivalent products of XC7Z035-1FBG676I chip are XC7Z030-1FBG676I, XC7Z045-1FBG676I, and XC7Z020-1FBG676I. These chips are part of the Xilinx Zynq-7000 family and offer similar features and performance capabilities. -
Features
- Dual-core ARM Cortex-A9 processor - FPGA fabric with 231,000 logic cells - 1GB DDR3 memory - 80x DSP slices - 6x PCIe Gen 2.0 - 4x Gigabit Ethernet - USB 2.0, UART, CAN, I2C, SPI, SDIO interfaces - 76 user I/O pins - Operating temperature range of -40°C to +100°C -
Pinout
XC7Z035-1FBG676I is a FPGA (Field Programmable Gate Array) with a total of 676 pins. It is a Zynq-7000 family device from Xilinx, with a dual-core ARM Cortex-A9 processor integrated with Artix-7 FPGA fabric. It is suitable for embedded system design, offering high processing power and flexibility. -
Manufacturer
XC7Z035-1FBG676I is manufactured by Xilinx, a company specializing in semiconductor devices, particularly programmable logic devices and related software. Xilinx is known for its field-programmable gate arrays (FPGAs) and is a key player in the industry, providing solutions for a wide range of applications in sectors such as automotive, aerospace, telecommunications, and more. -
Application Field
The XC7Z035-1FBG676I is commonly used in applications such as industrial control, automotive, telecommunications, medical imaging, aerospace, and defense. It is suitable for high-performance computing, signal processing, and image processing tasks that require a combination of processing power and programmable logic capabilities. -
Package
The XC7Z035-1FBG676I chip comes in a Ball Grid Array (BGA) package with 676 pins. It has a form factor of 35mm x 35mm and a size of 676-ball BGA with a 1mm pitch.
Ficha de dados PDF
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