Xilinx XC7Z010-1CLG225C

Part points

• The XC7Z010-1CLG225C chip is a system-on-chip (SoC) device designed for embedded processing and applications requiring high processing power. It is part of the Xilinx Zynq-7000 family and integrates a dual-core ARM Cortex-A9 processor with Xilinx programmable logic technology. The chip offers a range of features like high-speed connectivity, high-performance signal processing, and programmable logic flexibility, making it suitable for various applications such as industrial automation, automotive, and aerospace.

• Equivalent

  XC7Z020-1CLG225C and XC7Z030-1CLG225C are equivalent products to the XC7Z010-1CLG225C chip.

• Features

  XC7Z010-1CLG225C is a member of the Xilinx Zynq-7000 family. It is a System-on-Chip (SoC) that combines an ARM Cortex-A9 processor and programmable logic, with 28,000 logic cells, in a single device. It offers a range of features, including integrated memory, connectivity interfaces, and flexible programming options for various applications in automotive, industrial, and consumer electronics.

• Pinout

  The XC7Z010-1CLG225C is a 225-pin BGA package FPGA with 100 user I/Os. It is a Zynq-7000 SoC from Xilinx, combining an ARM Cortex-A9 processor and programmable logic elements.

• Manufacturer

  Xilinx is the manufacturer of the XC7Z010-1CLG225C. It is a semiconductor company specializing in the design and development of programmable logic devices and associated software tools.

• Application Field

  The XC7Z010-1CLG225C is a field-programmable gate array (FPGA) chip commonly used in various applications such as embedded processing, industrial automation, automotive, aerospace, and defense. It offers high performance, low power consumption, and flexibility for a wide range of applications that require customizable hardware acceleration and processing capabilities.

• Package

  The XC7Z010-1CLG225C chip has a BGA package type, it is in the form of a square chip, and its size is 225 grid array with a width of 17mm and a length of 17mm.