Xilinx XC7Z007S-1CLG225I

Part points

• The XC7Z007S-1CLG225I is a member of the Xilinx Zynq-7000 family of SoC devices. It features dual-core ARM Cortex-A9 processors alongside FPGA fabric, making it ideal for embedded system applications. With a CLG225 package and industrial-grade operating temperature range, this chip offers a balance of processing power and configurability for a wide range of applications.

• Equivalent

  Some equivalent products of XC7Z007S-1CLG225I chip are Xilinx XC7Z010-1CLG225C, Xilinx XC7Z010-1CLG225I, Xilinx XC7Z007S-1CLG225C, and Xilinx XC7Z007S-1CLG225I. These chips belong to the Xilinx Zynq-7000 series and have similar specifications and features.

• Features

  The XC7Z007S-1CLG225I is a Zynq-7000S family SoC with 7,200 logic cells, 1,870 KB RAM, 12 DSP slices, 80 IOs, and 10/100/1000 Ethernet PHY. It features dual-core ARM Cortex-A9 processor, on-chip programmable logic cells, memory interfaces, and peripherals for various embedded applications.

• Pinout

  The XC7Z007S-1CLG225I is a Xilinx Zynq-7000 series system-on-chip with a 225-pin BGA package. It features a dual-core Arm Cortex-A9 processor, programmable logic cells, and various peripherals for embedded processing applications.

• Manufacturer

  The manufacturer of XC7Z007S-1CLG225I is Xilinx, Inc. Xilinx is an American technology company that specializes in the design and development of field-programmable gate array (FPGA) and programmable logic devices. They provide solutions for a wide range of industries, including automotive, telecommunications, aerospace, and defense.

• Application Field

  The XC7Z007S-1CLG225I is a field-programmable gate array (FPGA) optimized for industrial, communication, and automotive applications. It is commonly used in embedded systems, industrial automation, motor control, networking equipment, and automotive infotainment systems.

• Package

  The XC7Z007S-1CLG225I chip is a BGA package type with a size of 225 pins. It has a form factor of 17x17mm.