Xilinx XC7K70T-2FBG676I

Part points

• The XC7K70T-2FBG676I chip is a member of Xilinx's Kintex-7 FPGA family. It is a high-performance and low-power programmable logic device capable of implementing complex digital systems. The particular chip variant, XC7K70T-2FBG676I, offers 69,120 logic cells, advanced memory capabilities, and a variety of high-speed I/O interfaces. It is commonly used in applications such as aerospace, automotive, telecommunications, and industrial automation.

• Equivalent

  XC7K70T-1FBG676I and XC7K70T-3FBG676I are the equivalent products of XC7K70T-2FBG676I chip.

• Features

  The XC7K70T-2FBG676I is a high-performance field-programmable gate array (FPGA) that features a 70,240 logic cells, 180 DSP slices, and 8.5Mb block RAM. It operates at a speed grade of -2 and comes in a 676-pin Flip Chip BGA package.

• Pinout

  The XC7K70T-2FBG676I is a field-programmable gate array (FPGA) with 676 ball grid array (BGA) package. It features 60 differential signaling inputs, 60 differential signaling outputs, and additional pins for power, ground, configuration, programming, and other functionalities required for the operation of the FPGA.

• Manufacturer

  The manufacturer of the XC7K70T-2FBG676I is Xilinx Inc. It is an American technology company that specializes in the development and manufacturing of programmable logic devices and software tools for digital signal processing and microcontrollers.

• Application Field

  The XC7K70T-2FBG676I is a field-programmable gate array (FPGA) chip with applications in industries such as telecommunications, aerospace, and defense. Its high-performance capabilities and flexibility make it suitable for complex computational tasks, signal processing, and data-intensive applications that require low power consumption and high reliability.

• Package

  The XC7K70T-2FBG676I chip belongs to the BGA676 package type, has a FBG form, and has a size of 676 balls.