Xilinx XC6SLX150T-3FGG900I

Part points

• The XC6SLX150T-3FGG900I chip is a field-programmable gate array (FPGA) from Xilinx, a leading manufacturer of programmable logic devices. It offers 147,443 logic cells, advanced DSP capabilities, and high-speed serial connectivity options. This FPGA chip is commonly used in various applications, including telecommunications, industrial automation, aerospace, and defense.

• Equivalent

  Some equivalent products to the XC6SLX150T-3FGG900I chip include XCS6SLX150T-3FGG900I, XC6SLX150TG-3FGG900I, XC6SLX150T-3FFG900I, XC6SLX150T-3CSG484I, and XC6SLX150T-3CSG484C. These chips belong to the Xilinx Spartan-6 FPGA family and have similar specifications and functionalities.

• Features

  The XC6SLX150T-3FGG900I is an FPGA with a maximum logic cell capacity of 147,443 and 6.4 Mb of internal RAM. It operates at a maximum frequency of 400 MHz and has 381 input/output pins. It supports various standard interfaces, including PCIe, Gigabit Ethernet, and USB 2.0.

• Pinout

  The XC6SLX150T-3FGG900I is a field-programmable gate array (FPGA) with a pin count of 900. It is a high-performance device designed for applications that require high logic capacity and high-speed performance. The specific functions of its pins may vary depending on the application and the design implemented using the FPGA.

• Manufacturer

  The manufacturer of the XC6SLX150T-3FGG900I is Xilinx. It is a leading semiconductor company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs), and other related technologies.

• Application Field

  The XC6SLX150T-3FGG900I is a high-end field-programmable gate array (FPGA) suitable for a wide range of applications including data center acceleration, wired communications, video and image processing, and high-performance computing. It offers high-speed serial connectivity, large capacity, and advanced digital signal processing capabilities.

• Package

  The XC6SLX150T-3FGG900I chip is a field-programmable gate array (FPGA) and comes in a flip-chip grid array (FGG) package. The package size is of 900-pins.