Xilinx XC2V1000-6BG575I

Part points

• The XC2V1000-6BG575I chip is a field-programmable gate array (FPGA) produced by Xilinx. It has a capacity of 1,008,960 logic cells and is designed for applications that require high-performance and programmability. This chip offers a power-efficient solution for electronic system designs and can be reconfigured to meet changing requirements.

• Equivalent

  The equivalent products of the XC2V1000-6BG575I chip are the XC2V1000-6FGG575C, XC2V1000-6FGG575I, XC2V1000-6FGG575C-ND, and XC2V1000-6FG256I chips.

• Features

  XC2V1000-6BG575I is a high-performance field-programmable gate array (FPGA) by Xilinx. It features 1000K system gates, 1 million system gates, 107840 logic cells, 80 I/Os, and operates at a maximum frequency of 158.3 MHz. It is designed for advanced digital applications requiring high processing capacity and flexibility.

• Pinout

  The XC2V1000-6BG575I is a field-programmable gate array (FPGA) with a pin count of 575. It is used for various digital applications and can be programmed and reprogrammed to fit specific needs.

• Manufacturer

  The manufacturer of the XC2V1000-6BG575I is Xilinx, Inc. It is an American technology company specializing in the development and manufacturing of programmable logic devices and associated software tools. Xilinx is known for its field-programmable gate array (FPGA) products, which are widely used in various industries such as telecommunications, automotive, aerospace, and more.

• Application Field

  The XC2V1000-6BG575I is a Field Programmable Gate Array (FPGA) and can be used in various application areas such as telecommunications, automotive, aerospace, industrial automation, and signal processing. Its flexibility allows for customization and adaptation to specific requirements in these industries.

• Package

  The XC2V1000-6BG575I chip has a BGA (Ball Grid Array) package type, a Type 2LE form factor, and a size of 575 balls.