Pedidos acima de
$5000ST NAND01GW3B2BN6F
The NAND01GW3B2BN6F is a flash memory component that features 128 megabits organized in an 8-bit configuration and comes in a PDSO48 package."
Marcas: Micron Technology
Parte do fabricante #: NAND01GW3B2BN6F
Ficha de dados: NAND01GW3B2BN6F Datasheet (PDF)
Pacote/Caso: TSOP
Tipo de Produto: Memória
Status RoHS:
Condição de estoque: 2.123 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
NAND01GW3B2BN6F Descrição geral
The NAND01GW3B2BN6F is a NAND flash memory chip manufactured by a company such as Toshiba, Micron, or Samsung. It belongs to the NAND flash memory family, typically used in various electronic devices like smartphones, tablets, SSDs, and USB flash drives for data storage. This specific chip likely has a storage capacity of 1 gigabit (Gb), which translates to about 128 megabytes (MB) of data storage. The "01" in the part number suggests it's a first-generation product within its series. The "GW3B2" likely denotes certain technical specifications such as interface type, voltage, or speed grade. The "BN6F" might specify the package type and configuration.NAND flash memory chips are characterized by their ability to retain data even when powered off, making them ideal for mass data storage in portable devices. They operate on the principle of electrically erasable programmable read-only memory (EEPROM), allowing for high-speed read and write operations. This particular chip, being a common component in electronic devices, adheres to industry standards for reliability, performance, and compatibility
Características
Aplicativo
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Category | NAND Flash | Package / Case | TSOP |
Memory Size | 1 Gbit | Interface Type | Parallel |
Organization | 128 M x 8 | Timing Type | Asynchronous |
Data Bus Width | 8 bit, 16 bit | Supply Voltage - Min | 2.7 V |
Supply Voltage - Max | 3.6 V | Supply Current - Max | 20 mA |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 85 C |
Active Read Current - Max | 20 mA | Architecture | Sectored |
Brand | Micron | Memory Type | NAND |
Product | NAND Flash | Product Type | NAND Flash |
Speed | 25 ns | Standard | Not Supported |
Subcategory | Memory & Data Storage |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
-
Etapa1 :produtos
-
Etapa2 :Embalagem a vácuo
-
Etapa3 :Saco antiestático
-
Etapa4 :Embalagem individual
-
Etapa5 :Caixas de embalagem
-
Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
-
The NAND01GW3B2BN6F chip is a NAND flash memory chip manufactured by Toshiba. It offers a storage capacity of 1 Gbit and supports a wide range of applications, including smartphones, tablets, and other electronic devices. The chip features fast read and write speeds, high reliability, and low power consumption.
-
Equivalent
Equivalent products of NAND01GW3B2BN6F chip are NAND01GW3B2BN6F, NAND02GW3B2AN6F, and NAND04GW3B2AN6F. These chips are all NAND Flash memory devices from the same manufacturer, Micron Technology. -
Features
NAND01GW3B2BN6F is a 1Gbit (128MB) SLC NAND flash memory from Micron with a voltage range of 1.7-1.95V, operating temperature range of -40°C to 85°C, and support for small page size operations. It has a NAND interface, ESD protection, and advanced memory management capabilities. -
Pinout
The NAND01GW3B2BN6F is a 8-pin NAND Flash memory chip with a capacity of 1 Gbit (128MB). Pin functions are: pin 1 (A0) for address input, pin 2 (A1) for address input, pin 3 (WE#) for Write Enable input, pin 4 (CLE) for Command Latch Enable input, pin 5 (ALE) for Address Latch Enable input, pin 6 (CE#) for Chip Enable input, pin 7 (CLE) for Command Latch Enable input, and pin 8 (Vcc) for power supply. -
Manufacturer
The manufacturer of the NAND01GW3B2BN6F is Micron Technology, Inc. They are a multinational corporation specializing in computer memory and data storage technology. Micron is one of the largest memory chip manufacturers in the world, providing solutions for a variety of industries such as consumer electronics, automotive, and enterprise data centers. -
Application Field
The NAND01GW3B2BN6F is commonly used in applications that require high-density storage solutions, such as SSDs, digital cameras, gaming consoles, and mobile devices. It is also used in industrial applications, telecommunications, automotive, and IoT devices. Its high performance, reliability, and low power consumption make it ideal for a wide range of applications. -
Package
The NAND01GW3B2BN6F chip is in a BGA package type, with a form factor of FBGA-63, and a size of 9.5mm x 12.5mm.
Ficha de dados PDF
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
-
Temos produtos ricos que podem atender às suas diversas necessidades.
-
A quantidade mínima de pedido começa em 1 unidade.
-
A menor taxa de envio internacional começa em US$ 0,00
-
365 dias de garantia de qualidade para todos os produtos
Ovaga's products are the backbone of our electronic projects. Their components are unmatched.