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IS43TR16256A-125KBLI

Name: IS43TR16256A-125KBLI
Rating: 4.5 (10 reviews)

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin TW-BGA

Marcas: INTEGRATED SILICON SOLUTION INC

Parte do fabricante #: IS43TR16256A-125KBLI

Ficha de dados: IS43TR16256A-125KBLI Ficha de dados (PDF)

Pacote/Caso: 96-TWBGA (9x13)

Tipo de Produto: Memória

Status RoHS:

Condição de estoque: 7.391 peças, novo original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Por favor, envie uma RFQ para IS43TR16256A-125KBLI ou e-mail para nós: E-mail: [email protected], entraremos em contato com você dentro de 12 horas.

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Observação

IS43TR16256A-125KBLI Descrição geral

SDRAM - DDR3 Memory IC 4Gbit Parallel 800 MHz 20 ns 96-TWBGA (9x13)

Características

Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
- Backward compatible to 1.5V
High speed data transfer rates with system frequency up to 1066 MHz
8 internal banks for concurrent operation
8n-Bit pre-fetch architecture
Programmable CAS Latency
Programmable Additive Latency: 0, CL-1,CL-2
Programmable CAS WRITE latency (CWL) based on tCK
Programmable Burst Length: 4 and 8
Programmable Burst Sequence: Sequential or Interleave
BL switch on the fly
Auto Self Refresh(ASR)
Self Refresh Temperature(SRT)
Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
Partial Array Self Refresh
Asynchronous RESET pin
TDQS (Termination Data Strobe) supported (x8 only)
OCD (Off-Chip Driver Impedance Adjustment)
Dynamic ODT (On-Die Termination)
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
Write Leveling
Up to 200 MHz in DLL off mode
Operating temperature:
Commercial (TC = 0°C to +95°C)
Industrial (TC = -40°C to +95°C)
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)

Especificações

Parâmetro	Valor	Parâmetro	Valor
Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	INTEGRATED SILICON SOLUTION INC	Package Description	TFBGA,
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.36	Samacsys Manufacturer	Integrated Silicon Solution Inc.
Access Mode	MULTI BANK PAGE BURST	Access Time-Max	0.1 ns
Additional Feature	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	JESD-30 Code	R-PBGA-B96
Length	13 mm	Memory Density	4294967296 bit
Memory IC Type	DDR DRAM	Memory Width	16
Number of Functions	1	Number of Ports	1
Number of Terminals	96	Number of Words	268435456 words
Number of Words Code	256000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	256MX16	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Seated Height-Max	1.2 mm
Self Refresh	YES	Supply Voltage-Max (Vsup)	1.575 V
Supply Voltage-Min (Vsup)	1.425 V	Supply Voltage-Nom (Vsup)	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Width	9 mm

Envio

	Taxa de envio	Tempo de espera
DHL	$20.00-$40.00 (0.50 KG)	2-5 dias
FedEx	$20.00-$40.00 (0.50 KG)	2-5 dias
UPS	$20.00-$40.00 (0.50 KG)	2-5 dias
TNT	$20.00-$40.00 (0.50 KG)	2-5 dias
EMS	$20.00-$40.00 (0.50 KG)	2-5 dias
CORREIO AÉREO REGISTADO	$20.00-$40.00 (0.50 KG)	2-5 dias

Tempo de processamento: A taxa de envio depende de diferentes zonas e países.

Pagamento

Termos de pagamento		Taxa de mão
	Transferência bancária	cobrar taxa bancária de US$ 30,00.
	PayPal	cobrar taxa de serviço de 4,0%.
	Cartão de crédito	cobrar taxa de serviço de 3,5%.
	Western Union	charge US.00 banking fee.
	Grama de dinheiro	cobrar taxa bancária de US$ 0,00.

Garantias

1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.

2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.

Embalagem

Etapa1 :produtos
Etapa2 :Embalagem a vácuo
Etapa3 :Saco antiestático
Etapa4 :Embalagem individual
Etapa5 :Caixas de embalagem
Etapa6 :etiqueta de envio com código de barras

Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.

Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.

Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.

Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.

Part points

The IS43TR16256A-125KBLI chip is a memory device commonly used in electronic devices such as smartphones, tablets, and computers. It offers a storage capacity of 256 megabytes and operates at a clock frequency of 125 MHz. Designed for high-speed data transfer, it uses a synchronous interface and provides reliable performance and low power consumption.
Features

IS43TR16256A-125KBLI is a 256Mb DDR3L SDRAM memory chip. It operates at a speed of 125MHz and supports a dual data rate of 800Mbps. The chip has a low voltage operation of 1.35V and offers high bandwidth, low power consumption, and non-volatile storage capabilities.
Pinout

The IS43TR16256A-125KBLI has a pin count of 90 and is a Double Data Rate (DDR) synchronous DRAM (SDRAM) chip. It is primarily used for high-performance applications, offering a storage capacity of 256 megabits (32 megabytes). The functions of its pins include data input/output, address inputs, control signals, and power connections.
Manufacturer

The IS43TR16256A-125KBLI is manufactured by Integrated Silicon Solution Inc. (ISSI). ISSI is a semiconductor company that specializes in the design, development, and production of high-performance integrated circuits for a wide range of applications, including automotive, industrial, consumer, and communications markets.
Application Field

The IS43TR16256A-125KBLI is a 4Gb (512Mx8, 256Mx16) synchronous DRAM designed for high-speed memory systems. It can be used in various applications such as mobile devices, networking equipment, graphics cards, and automotive electronics, where high-density and low-power consumption memory is required.
Package

The IS43TR16256A-125KBLI chip is available in a package type called BGA (Ball Grid Array). Its form is a 12mm x 14mm 96-ball BGA package, making it compact and suitable for various electronic applications.

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