Altera EP4SGX360HF35C2N
FPGA Stratix® IV GX Family 353600 Cells 40nm Technology 0.9V 1152-Pin FC-FBGA
Marcas: Altera Corporation (Intel)
Parte do fabricante #: EP4SGX360HF35C2N
Ficha de dados: EP4SGX360HF35C2N Ficha de dados (PDF)
Pacote/Caso: FBGA-1152
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 3421 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaEP4SGX360HF35C2N Descrição geral
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 23105536 353600 1152-BBGA, FCBGA
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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feature-family-name | Stratix® IV GX | feature-process-technology | 40nm |
feature-maximum-number-of-user-i-os | 560 | feature-number-of-registers | 282880 |
feature-device-logic-cells | 353600 | feature-device-system-gates | |
feature-number-of-multipliers | 1040 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 22564 | feature-total-number-of-block-ram | 48+1248 |
feature-ethernet-macs | 1 | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V-by-One HS|UART|SD/MMC SPI |
feature-supported-ip-core-manufacture | Altera/CAST, Inc/Bitec/Eureka Technology Inc/El Camino GmbH | feature-maximum-number-of-serdes-channels | 44 |
feature-device-logic-units | 353600 | feature-device-number-of-dlls-plls | 6 |
feature-transceiver-blocks | 24 | feature-transceiver-speed-gbps | 8.5 |
feature-dedicated-dsp | 130 | feature-pci-blocks | 2 |
feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
feature-speed-grade | 2 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | LVPECL|LVDS | feature-single-ended-i-o-standards-supported | LVTTL|CMOS|PCI|PCI-X|SSTL|HSTL |
feature-external-memory-interface | DDR2 SDRAM|DDR3 SDRAM|RLDRAM II|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 0.87 |
feature-maximum-operating-supply-voltage-v | 0.93 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 1152 | feature-supplier-package | FC-FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A001.a.7.a |
feature-svhc |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The EP4SGX360HF35C2N chip is a high-performance field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It offers advanced capabilities for designing and implementing complex digital systems. With its high-speed processing, low power consumption, and versatile programmability, the EP4SGX360HF35C2N chip is widely used in applications such as telecommunications, aerospace, defense, and industrial automation.
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Equivalent
The equivalent products to the EP4SGX360HF35C2N chip are the EP4SGX360HF35C4N and EP4SGX360KF40C2N chips. -
Features
The EP4SGX360HF35C2N is an Altera Stratix IV GX FPGA with 360K logic elements, supporting up to 28.05 Gbps transceivers for high-speed communication. It features embedded memory, PLLs, and provides advanced DSP capabilities. It is capable of handling complex operations and is often used in high-performance computing, telecommunications, and networking applications. -
Pinout
The EP4SGX360HF35C2N is a Stratix IV GX FPGA device developed by Intel. It has a pin count of 1517 and is designed to offer high-speed performance and low power consumption. The specific functions and capabilities of the device's pins can be found in the corresponding datasheet provided by the manufacturer. -
Manufacturer
The EP4SGX360HF35C2N is manufactured by Intel. Intel is a multinational technology company that specializes in designing and manufacturing a wide range of computer hardware products, including processors, motherboards, and other components. -
Application Field
The EP4SGX360HF35C2N is a field-programmable gate array (FPGA) designed by Intel. It is commonly used in various application areas such as high-performance computing, data center acceleration, signal processing, and network infrastructure. Its versatility and adaptability make it suitable for a wide range of applications that require high computing power and customizable hardware. -
Package
The package type of the EP4SGX360HF35C2N chip is F35 (FBGA), its form is BGA (Ball Grid Array), and its size is 35mm x 35mm.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos