Intel EP4CGX30CF23C8N

Part points

• The EP4CGX30CF23C8N is a high-performance programmable logic device (PLD) manufactured by Intel (formerly Altera). It belongs to the Cyclone IV GX family and offers 30,000 logic elements, 306 user I/Os, and 23,136 Kbits of embedded memory. The chip is ideal for applications requiring high-speed processing, low power consumption, and high levels of integration.

• Equivalent

  The equivalent products of EP4CGX30CF23C8N chip are EP4CE30F23C8N, EP4CFA30C7N, EP4CFA30C6N, EP4CGX30CF23I7N, EP4CE30F23I7N, EP4CGX30CF23I8N. These chips belong to the Cyclone IV FPGA family by Intel (Altera). They have similar features and specifications to the EP4CGX30CF23C8N chip.

• Features

  EP4CGX30CF23C8N is a low-cost, low-power CPLD in a 144-pin FineLine BGA package. It features 30208 logic elements, 476 Kbits of RAM, 149 embedded 18 x 18 multipliers, and up to 240 user I/O pins. It operates at a maximum of 275 MHz and has on-chip oscillator and PLL.

• Pinout

  The EP4CGX30CF23C8N is a 624-pin FPGA with 292 user I/Os, 3.3V supply voltage, and 830 MHz maximum operating frequency. It contains 30,000 logic elements and 1,152 Kbits of RAM. It can be reprogrammed to perform a wide variety of functions such as data processing, signal processing, and control applications.

• Manufacturer

  The EP4CGX30CF23C8N is manufactured by Intel. Intel is an American multinational corporation that produces computer processors, motherboards, and other electronics components. It is one of the largest semiconductor chip manufacturers in the world and is known for its dominance in the computing industry.

• Application Field

  The EP4CGX30CF23C8N is commonly used in industrial automation, telecommunications, automotive, and consumer electronics applications. It is suitable for a wide range of functions including data processing, image and signal processing, and control system design. Its small size and low power consumption make it ideal for embedded systems and portable devices.

• Package

  The EP4CGX30CF23C8N chip comes in a Ball Grid Array (BGA) package type, with a form factor of 672-balls. It has a size of 17mm x 17mm and is designed for use in advanced FPGA designs requiring high performance capabilities.