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$5000Intel EP4CE115F29C8N
OTHER 2003 RoHS Compliant BALL FPGA 85C 486kB 200MHz 1.25V
Marcas: Intel Corp
Parte do fabricante #: EP4CE115F29C8N
Ficha de dados: EP4CE115F29C8N Datasheet (PDF)
Pacote/Caso: FBGA-780
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 3.677 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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EP4CE115F29C8N Descrição geral
Housed in a compact 780-pin FBGA package, this FPGA offers high levels of integration without compromising on performance. Its design caters to industries such as telecommunications, automotive, and industrial automation, highlighting its adaptability and reliability in demanding environments
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| feature-family-name | Cyclone® IV E | feature-process-technology | 60nm |
| feature-maximum-number-of-user-i-os | 528 | feature-number-of-registers | |
| feature-device-logic-cells | 114480 | feature-device-system-gates | |
| feature-number-of-multipliers | 266 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 3888 | feature-total-number-of-block-ram | 432 |
| feature-ethernet-macs | feature-supported-ip-core | Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core | |
| feature-supported-ip-core-manufacture | Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley | feature-maximum-number-of-serdes-channels | |
| feature-device-logic-units | 114480 | feature-device-number-of-dlls-plls | 4 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | 266 | feature-pci-blocks | 1 |
| feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
| feature-speed-grade | 8 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
| feature-external-memory-interface | DDR SDRAM|DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 780 | feature-supplier-package | FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | 3A991 |
| feature-svhc | No |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The EP4CE115F29C8N chip is a field programmable gate array (FPGA) developed by Altera. It features a capacity of 114,480 logic elements, 4,608 embedded memory blocks, and several configurable I/O pins. The chip is designed for various applications like telecommunications, industrial control, and image processing. It offers flexibility and reconfigurability with high-performance capabilities for complex digital circuit designs.
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Equivalent
Some equivalent products of EP4CE115F29C8N chip are EP4CE110F29C8N, EP4CE115F29C9N, and EP4CE115F29C6N. These chips are all part of the Cyclone IV FPGA family and have similar features and capabilities. -
Features
EP4CE115F29C8N is a field-programmable gate array (FPGA) that features 115,200 logic elements, 6,048 Kbit embedded memory, and 532 user I/O pins. It operates at a maximum frequency of 350 MHz, supports DDR3 memory, and offers abundant digital signal processing (DSP) resources. Additionally, it has low power consumption and provides secure and reliable communication capabilities. -
Pinout
The EP4CE115F29C8N is a 115,200 Logic Element FPGA (Field-Programmable Gate Array) with 780 pins. It is used for general-purpose digital logic applications and can implement complex digital designs. The specific functions of the pins can be found in the datasheet provided by the manufacturer. -
Manufacturer
The EP4CE115F29C8N is manufactured by Intel Corporation. It is a multinational technology company specializing in the development and production of semiconductor chips and related products. -
Application Field
The EP4CE115F29C8N is an FPGA device from the Cyclone IV family. It can be used in various application areas such as industrial automation, telecommunications, video and image processing, automotive, medical equipment, and more. Its high-performance capabilities make it suitable for a wide range of applications requiring programmable logic. -
Package
The EP4CE115F29C8N chip is packaged in a BGA (Ball Grid Array) package type. It has a form factor of 1156-BGA and a size of 29 mm x 29 mm.
Ficha de dados PDF
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