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BSM30GP60
24-Pin ECONO2-5 Package
Marcas: Infineon
Parte do fabricante #: BSM30GP60
Ficha de dados: BSM30GP60 Ficha de dados (PDF)
Pacote/Caso: EconoPIM2
Status RoHS:
Condição de estoque: 7908 peças, novo original
Tipo de Produto: IGBT Modules
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
| Quantidade | Preço unitário | Preço Externo |
|---|---|---|
| 1 | $235,592 | $235,592 |
| 200 | $91,171 | $18234,200 |
| 500 | $87,967 | $43983,500 |
| 1000 | $86,384 | $86384,000 |
In Stock:7908 PCS
BSM30GP60 Descrição geral
The BSM30GP60 is a power module designed for use in motor control applications. It is part of the SEMIKRON MiniSKiiP product family and features a half-bridge topology with an integrated IGBT and diode. The module has a voltage rating of 600V, a current rating of 30A, and a nominal power dissipation of 168W.The BSM30GP60 module is compact in size, measuring just 62mm x 30mm x 7mm, and is designed for easy integration into motor control systems. It offers low losses and high efficiency, making it ideal for applications where energy efficiency is a priority. The module is also designed for high reliability, with features such as overcurrent protection, short-circuit protection, and temperature monitoring to ensure safe and reliable operation.In terms of electrical characteristics, the BSM30GP60 module has a typical saturation voltage of 1.8V at a current of 30A and a typical threshold voltage of 2.3V. The module has a maximum junction temperature of 150°C and a maximum storage temperature of -40°C to 125°C.
Características
- BSM30GP60 is a 600V, 30A IGBT power module
- It features low stray inductance and low thermal resistance
- The module includes a NTC temperature sensor for over-temperature protection
- High short-circuit capability and low VCE(sat)
- Designed for high-frequency operation in hard switching applications
Aplicativo
- Industrial motor drives
- Wind power converters
- Solar inverters
- UPS systems
- Induction heating equipment
- Switching power supplies
- Welding equipment
- Automotive applications
- Medical equipment
- Telecommunication systems
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Product Category | IGBT Modules | RoHS | Details |
| Product | IGBT Silicon Modules | Configuration | Hex |
| Collector- Emitter Voltage VCEO Max | 600 V | Collector-Emitter Saturation Voltage | 2.45 V |
| Continuous Collector Current at 25 C | 50 A | Gate-Emitter Leakage Current | 300 nA |
| Pd - Power Dissipation | 180 W | Package / Case | EconoPIM2 |
| Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 125 C |
| Brand | Infineon Technologies | Height | 17 mm |
| Length | 107.5 mm | Maximum Gate Emitter Voltage | 20 V |
| Mounting Style | Chassis Mount | Product Type | IGBT Modules |
| Factory Pack Quantity | 10 | Subcategory | IGBTs |
| Technology | Si | Width | 45 mm |
| Part # Aliases | SP000100378 BSM30GP60BOSA1 |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
 |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The BSM30GP60 is a power module chip designed for use in various high-frequency switching applications. It integrates multiple power components into a single package, providing enhanced performance, efficiency, and reliability. The chip features low switching losses and high current capabilities, making it ideal for motor drives, renewable energy systems, and other power electronics applications.
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Equivalent
The equivalent products of the BSM30GP60 chip include BSM15GD120DN2, BSM15GP120DN2, BSM50GD120DN2, and BSM50GP120DN2. -
Features
BSM30GP60 is a 600V, 30A IGBT Power Module with integrated thermal sensor. It has low conduction and switching losses, high ruggedness and reliability, and compact size for easy mounting and replacement. It offers excellent thermal performance and high efficiency in various power electronic applications. -
Pinout
The BSM30GP60 is a 30 amp, 600 volt IGBT module with 7 pins. Pin functions include gate, emitter, collector, positive and negative terminals, and two auxiliary pins. -
Manufacturer
Infineon Technologies is the manufacturer of the BSM30GP60. Infineon Technologies is a German semiconductor company that produces various types of semiconductor products, including power modules like the BSM30GP60. The company focuses on providing solutions for various industries, such as automotive, industrial, and power management. -
Application Field
The BSM30GP60 is a high voltage insulated gate bipolar transistor (IGBT) used in power electronic applications such as motor drives, inverters, and converters. Its low on-state voltage drop and high switching speed make it suitable for high power density applications requiring efficient and reliable power switching. -
Package
The BSM30GP60 chip is typically packaged in a module form known as a Power Module. It usually comes in a standard size of around 30 x 50 mm. The chip itself is a IGBT (Insulated Gate Bipolar Transistor) and has a current rating of 30A and 600V.
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