BSM200GD60DLC
39 PIN Insulated Gate Bipolar Transistor, N-Channel, 226A I(C), 600V V(BR)CES, ECONO"
Marcas: Infineon
Parte do fabricante #: BSM200GD60DLC
Ficha de dados: BSM200GD60DLC Ficha de dados (PDF)
Pacote/Caso: EconoPACK 3A
Status RoHS:
Condição de estoque: 6572 peças, novo original
Tipo de Produto: IGBT Modules
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $293,805 | $293,805 |
30 | $281,890 | $8456,700 |
In Stock:6572 PCS
BSM200GD60DLC Descrição geral
BSM200GD60DLC is a dual IGBT module developed by Infineon Technologies AG. It is optimized for industrial applications with high power requirements. The module features a half-bridge topology with a current rating of 200A and a voltage rating of 600V. BSM200GD60DLC is designed to operate at a wide temperature range, making it suitable for various industrial environments. It is equipped with a high-performance IGBT chip that ensures efficiency and reliability. The module also includes integrated freewheeling diodes, allowing for simpler circuit designs and reducing overall system costs.This module is compact and lightweight, making it easy to integrate into existing systems. It also features high power density, enabling it to deliver high power output in a small footprint. The BSM200GD60DLC is equipped with advanced protection features, such as overcurrent and overtemperature protection, ensuring the safety and longevity of the module.
Características
- High power module with 600V / 200A rating
- Designed for industrial applications
- Half-bridge configuration
- Low thermal resistance
- Low switching losses
- Integrated gate driver with under-voltage protection
- Soft punching IGBT technology
- Optimized for high efficiency and reliability
Aplicativo
- Wind turbines
- Solar power inverters
- Industrial drives
- Uninterruptible power supplies (UPS)
- Electric vehicles
- Renewable energy systems
- Power factor correction
- Motor control
- Electric grid stabilization
- Energy storage systems
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Product Category | IGBT Modules | RoHS | N |
Product | IGBT Silicon Modules | Configuration | Hex |
Collector- Emitter Voltage VCEO Max | 600 V | Collector-Emitter Saturation Voltage | 2.45 V |
Continuous Collector Current at 25 C | 226 A | Gate-Emitter Leakage Current | 400 nA |
Pd - Power Dissipation | 700 W | Package / Case | EconoPACK 3A |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 125 C |
Brand | Infineon Technologies | Height | 17 mm |
Length | 122 mm | Maximum Gate Emitter Voltage | 20 V |
Mounting Style | Chassis Mount | Product Type | IGBT Modules |
Factory Pack Quantity | 10 | Subcategory | IGBTs |
Technology | Si | Width | 62 mm |
Part # Aliases | SP000100395 BSM200GD60DLCBOSA1 |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The BSM200GD60DLC chip is an IGBT module designed for high power applications such as motor drives and inverters. It has a maximum voltage rating of 600V and a current rating of 200A. The chip features low on-state voltage drop, high short circuit capability, and fast switching speed. It also incorporates advanced thermal design and protection features for efficient and reliable operation.
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Equivalent
The equivalent products of the BSM200GD60DLC chip are the BSM200GD60DLCK and the BSM200GD60DLCP, which are also IGBT modules. -
Features
The main features of BSM200GD60DLC are dual IGBT modules, with a current rating of 200A and a voltage rating of 600V. It has low saturation voltage and low switching loss, making it suitable for various power electronic applications such as motor drives, inverters, and UPS systems. -
Pinout
The BSM200GD60DLC is a dual IGBT module with a pin count of 19. Its main function is to control the power flow between a high-voltage DC bus and a three-phase motor. The module is commonly used in applications such as electric vehicles, industrial drives, and renewable energy systems. -
Manufacturer
The manufacturer of the BSM200GD60DLC is Infineon Technologies AG. It is a German semiconductor manufacturer specializing in power semiconductors and system solutions for various industries, including automotive, industrial, and renewable energy. -
Application Field
The BSM200GD60DLC is a module designed for a wide range of applications such as motor control in industrial automation, robotics, power supplies, solar inverters, and renewable energy systems. Its high power density, low thermal resistance, and high current capability make it suitable for demanding applications that require efficient and reliable power conversion. -
Package
The BSM200GD60DLC chip has a package type of module, a form of six-pack, and a size of compact.
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