NXP BGM1014

Part points

• The BGM1014 chip is a Bluetooth Low Energy (BLE) System-on-Chip (SoC) designed by Silicon Labs for a variety of IoT and wearable applications. It offers a range of features such as low power consumption, integrated radio, and a powerful ARM Cortex-M4 processor. The BGM1014 chip provides a flexible and cost-effective solution for developing connected devices.

• Equivalent

  The equivalent products of the BGM1014 chip are the NRF52832 and NRF52840 from Nordic Semiconductor, as they have similar features and capabilities. These chips offer Bluetooth connectivity, low power consumption, and high performance suitable for wearable devices, IoT applications, and other wireless communication systems.

• Features

  BGM1014 is a lithium-ion battery protection management solution chip. Its features include overcharge protection, over-discharge protection, overcurrent protection, short circuit protection, temperature protection, and balancing control. It helps to ensure the safety and longevity of lithium-ion batteries in various electronic devices.

• Pinout

  The BGM1014 is a Bluetooth module with 14 pins, including power, ground, UART, and GPIO pins. It provides wireless connectivity for IoT and wearable devices, with low power consumption and support for BLE protocol. It is commonly used for smart home devices, fitness trackers, and medical applications.

• Manufacturer

  The manufacturer of the BGM1014 is Bosch. Bosch is a multinational engineering and technology company based in Germany. They specialize in the production of automotive parts, power tools, home appliances, and security systems. Bosch is known for its innovative and high-quality products in various fields of engineering and technology.

• Application Field

  The BGM1014 is commonly used in applications such as wearable health and fitness trackers, smartwatches, activity monitors, and medical devices. It is also suitable for use in IoT devices, consumer electronics, and industrial applications that require low power consumption and small form factor.

• Package

  The BGM1014 chip comes in a BGA package type, with a form factor that is 3.4mm x 3.4mm x 0.6mm. The package size for the BGM1014 chip is 25-ball grid array (BGA).