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$5000A3PE3000-FGG484I
ProASIC3E Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA
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Marcas: MICROCHIP TECHNOLOGY INC
Parte do fabricante #: A3PE3000-FGG484I
Ficha de dados: A3PE3000-FGG484I Ficha de dados (PDF)
Pacote/Caso: FBGA
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 6.554 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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A3PE3000-FGG484I Descrição geral
The A3PE3000-FGG484I ProASIC3 FPGA is designed to deliver high performance in ultra low density applications. With a system performance of 350 MHz, this FPGA offers a powerful solution for designers looking to optimize performance in a compact package. One of the key advantages of the ProASIC3 is its proven security features, which safeguard against overbuilding and cloning, ensuring the protection of your intellectual property. Furthermore, the A3PE3000-FGG484I provides exceptional reliability, giving you confidence in the consistent operation of your system. With a focus on total cost of ownership, this FPGA offers a cost-effective solution without compromising on performance or security
Características
- Octo-core ARM Cortex-A17 processor
- 8GB LPDDR4 memory
- 64Mbyte Flash memory
- SATA III and PCIe interfaces
- USB 3.0 hub with 6 ports
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | Package Description | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 |
Reach Compliance Code | compliant | HTS Code | 8542.39.00.01 |
Factory Lead Time | 52 Weeks | Clock Frequency-Max | 350 MHz |
JESD-30 Code | S-PBGA-B484 | JESD-609 Code | e1 |
Length | 23 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 75264 | Number of Equivalent Gates | 3000000 |
Number of Inputs | 341 | Number of Logic Cells | 75264 |
Number of Outputs | 341 | Number of Terminals | 484 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 75264 CLBS, 3000000 GATES | Package Body Material | PLASTIC/EPOXY |
Package Code | BGA | Package Equivalence Code | BGA484,22X22,40 |
Package Shape | SQUARE | Package Style | GRID ARRAY |
Packing Method | TRAY | Peak Reflow Temperature (Cel) | 250 |
Power Supplies | 1.5/3.3 V | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 2.44 mm |
Supply Voltage-Max | 1.575 V | Supply Voltage-Min | 1.425 V |
Supply Voltage-Nom | 1.5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The A3PE3000-FGG484I is a field-programmable gate array (FPGA) chip from Microsemi Corporation. It features 3 million system gates, 129,600 bits of block RAM, and 178 user I/Os. The chip is designed for high-performance applications in telecommunications, industrial automation, and automotive industries.
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Equivalent
Some equivalent products of the A3PE3000-FGG484I chip are A3P1000-FGG484I, A3P1500-FGG484I, A3P2000-FGG484I, A3P2500-FGG484I, and A3P3500-FGG484I. These chips are part of the A3P family of devices from Actel/Microsemi, offering similar features and capabilities. -
Features
The A3PE3000-FGG484I is a FPGA (Field-Programmable Gate Array) with 3,000 logic elements and 221 KB of embedded memory. It features 324 I/O pins, 6 PLLs, and 504 user I/Os. This device is ideal for applications that require high levels of customization and flexibility. -
Pinout
A3PE3000-FGG484I is a 484-pin FPGA with a capacity of 3 million system gates. It offers high performance and low power consumption, making it ideal for a wide range of applications such as telecommunications, industrial automation, and more. -
Manufacturer
The manufacturer of A3PE3000-FGG484I is Microsemi Corporation. Microsemi is an American semiconductor company that specializes in power management, RF, analog, mixed-signal, and custom devices for aerospace and defense, communications, data center, and industrial markets. -
Application Field
A3PE3000-FGG484I is a field-programmable gate array (FPGA) that is commonly used in a variety of applications such as telecommunications, networking, automotive, industrial automation, and medical devices. It is also suitable for high-performance computing, digital signal processing, and image processing applications. -
Package
The A3PE3000-FGG484I chip is in a ball grid array (BGA) package, with a form factor of 484 solder balls arranged in a grid pattern. The size of the BGA package is typically around 23 mm x 23 mm.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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