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$5000Xilinx XCZU11EG-2FFVF1517I
XCZU11EG-2FFVF1517I integrated circuit
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Marcas: Xilinx
Parte do fabricante #: XCZU11EG-2FFVF1517I
Ficha de dados: XCZU11EG-2FFVF1517I Datasheet (PDF)
Pacote/Caso: FBGA-1517
Tipo de Produto: System On Chip (SoC)
Status RoHS:
Condição de estoque: 3.392 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCZU11EG-2FFVF1517I Descrição geral
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1517-FCBGA (40x40)
![xczu11eg-2ffvf1517i xczu11eg-2ffvf1517i](/files/uploads/product/b/xczu11eg-2ffvf1517i20221018154202_4369.jpg)
Características
- MPSoC device with a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5 processor, and programmable logic.
- 256Kb of on-chip memory and up to 6GB of DDR4 memory support.
- 12.5 Gbps transceivers for high-speed connectivity.
- Programmable logic with up to 1.4 million logic cells, up to 4,272 DSP slices, and up to 5520 Kb of UltraRAM.
- Power-optimized for reduced power consumption.
Aplicativo
- Industrial control and automation
- Aerospace and defense
- Automotive driver assistance systems
- Communications infrastructure
- Video and image processing
![Xilinx Inventory Xilinx Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Product Category | SoC FPGA | Shipping Restrictions | This product may require additional documentation to export from the United States. |
RoHS | Details | Mounting Style | SMD/SMT |
Package / Case | FBGA-1517 | Core | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 |
Number of Cores | 7 Core | Maximum Clock Frequency | 600 MHz, 667 MHz, 1.5 GHz |
L1 Cache Instruction Memory | 2 x 32 kB, 4 x 32 kB | L1 Cache Data Memory | 2 x 32 kB, 4 x 32 kB |
Number of Logic Elements | 653100 LE | Adaptive Logic Modules - ALMs | 37320 ALM |
Embedded Memory | 21.1 Mbit | Number of I/Os | 496 I/O |
Operating Supply Voltage | 850 mV | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 100 C | Brand | Xilinx |
Distributed RAM | 9.1 Mbit | Embedded Block RAM - EBR | 21.1 Mbit |
Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 37320 LAB |
Number of Transceivers | 48 Transceiver | Product Type | SoC FPGA |
Series | XCZU11EG | Factory Pack Quantity | 1 |
Subcategory | SOC - Systems on a Chip | Tradename | Zynq UltraScale+ |
Unit Weight | 1 lb |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XCZU11EG-2FFVF1517I chip is a powerful field-programmable gate array (FPGA) from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and features a high-performance ARM Cortex-A53 quad-core processor combined with programmable logic cells. This chip enables the integration of processing and programmable logic in a single device, making it suitable for a wide range of applications requiring high-performance computing and custom digital circuitry.
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Features
The XCZU11EG-2FFVF1517I is a Xilinx Zynq UltraScale+ MPSoC device. It features a quad-core ARM Cortex-A53 processor and a high-performance programmable logic. It offers a wide range of connectivity interfaces, including PCIe, USB, and Gigabit Ethernet. The device also supports high-resolution video processing and includes DSP capabilities for efficiently running signal processing algorithms. -
Pinout
The XCZU11EG-2FFVF1517I has a pin count of 1517. It is a programmable system-on-chip (SoC) that combines a processing system with programmable logic for various applications, including automotive, industrial, and defense systems. -
Manufacturer
The manufacturer of the XCZU11EG-2FFVF1517I is Xilinx. Xilinx is an American technology company specializing in the design and production of programmable logic devices and associated software development tools. They are a leading provider of field-programmable gate arrays (FPGAs) and other programmable logic devices used in various industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XCZU11EG-2FFVF1517I is a field-programmable gate array (FPGA) that can be used in various application areas, including telecommunications, automotive, aerospace, industrial automation, and high-performance computing. It combines high-speed processing, programmable logic, and customizable I/O interfaces, making it suitable for a wide range of applications. -
Package
The XCZU11EG-2FFVF1517I chip is package type 1517, form factor FF, and has a size of 15x17 mm.
Ficha de dados PDF
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