Xilinx XCKU15P-2FFVE1517I

Part points

• The XCKU15P-2FFVE1517I is a high-performance FPGA chip from Xilinx, featuring a 40nm architecture with up to 1.16M logic cells, 6080 DSP slices, and 90Mb of block RAM. It also includes a wide range of I/O options, high-speed transceivers, and advanced processing capabilities, making it suitable for a variety of applications in industries such as communications, aerospace, and defense.

• Equivalent

  Equivalent products of XCKU15P-2FFVE1517I chip are XCKU15P-2FFVE1517E, XCKU15P-2FFVE1517C, and XCKU15P-2FFVE1517L. These chips may have different features, such as speed grades or package types, but are generally compatible in terms of functionality and performance.

• Features

  The XCKU15P-2FFVE1517I is a field-programmable gate array (FPGA) featuring a 900 MHz maximum operating frequency, 1.143 million system logic cells, 2,520 DSP slices, and 58,560 LUTs. It also includes 2136 I/Os, 60 transceivers with a maximum data rate of 16.3 Gbps, and an operating temperature range of -40°C to 100°C.

• Pinout

  The XCKU15P-2FFVE1517I is a 1517-pin FPGA from Xilinx. It features a wide variety of I/O capabilities, including dedicated high-speed serial interfaces, advanced memory interfaces, and general-purpose I/Os for connecting to external devices. It also includes powerful processing elements for implementing complex functions and algorithms.

• Manufacturer

  The XCKU15P-2FFVE1517I is manufactured by Xilinx, Inc. Xilinx is an American technology company that designs and produces programmable devices such as field-programmable gate arrays (FPGAs) and software development tools. They are known for their innovations in hardware acceleration and advanced computer technologies.

• Application Field

  The XCKU15P-2FFVE1517I is commonly used in applications such as aerospace and defense systems, industrial control systems, data center networking, and high-performance computing. It is also suitable for use in telecommunications, automotive, and medical imaging equipment requiring high processing power and reliable performance.

• Package

  The XCKU15P-2FFVE1517I chip is a Field Programmable Gate Array (FPGA) with a flip chip solder bump package type, in the form of a 1517-ball Fine-pitch Ball Grid Array (FBGA). The size of the package is 23mm x 23mm with a ball pitch of 0.8mm.