Xilinx XCKU060-2FFVA1517I

Part points

• The XCKU060-2FFVA1517I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Xilinx Kintex UltraScale+ family and offers a considerable computing capability and flexibility for various applications. The chip has a high-performance architecture, integrating advanced features like powerful DSP slices, on-chip memory, and high-speed transceivers, making it suitable for a wide range of applications in communications, aerospace, defense, and more.

• Equivalent

  There are no direct equivalent products to the XCKU060-2FFVA1517I chip. However, some alternative options for a similar performance may include XCKU085-2FFVA1156I or XCKU040-2FFVA1156I chips offered by Xilinx.

• Features

  The XCKU060-2FFVA1517I is an FPGA device. It belongs to the Xilinx Kintex UltraScale+ family and has 56.8Mb of block RAM, 360 DSP slices, a maximum of 2800 logic slices, and a peak DSP performance of 18.1 TFLOPs. It operates on 0.95V to 1.05V voltage, has 665 available user I/O, and supports advanced interfaces like PCIe Gen3 x 16.

• Pinout

  The XCKU060-2FFVA1517I is a field-programmable gate array (FPGA) with a BGA package. It has a pin count of 1517 pins. The specific pin functions can be obtained from the device datasheet, as it varies based on the applications and configurations for which the FPGA is used.

• Manufacturer

  The XCKU060-2FFVA1517I is manufactured by Xilinx Inc. Xilinx is an American technology company specializing in the development and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs).

• Application Field

  The XCKU060-2FFVA1517I is a FPGA (Field-Programmable Gate Array) chip, commonly used in applications that require high-performance processing and reconfigurable hardware. It finds wide applications in industries such as aerospace and defense, telecommunications, industrial automation, and scientific research for tasks like signal processing, data analysis, image and video processing, and control systems design.

• Package

  The XCKU060-2FFVA1517I chip is available in a flip-chip package type. It comes in a form factor with a size of 35 mm x 35 mm.